QCA-8386-1-DRQFN172-MT-00-0 Gigabit Ethernet PHY Transceiver IC

QCA-8386-1-DRQFN172-MT-00-0 Overview

The QCA-8386-1-DRQFN172-MT-00-0 is a 172-pin DRQFN packaged integrated circuit intended for board-level integration where a compact, low-profile package with many I/O connections is required. The ordering suffix and tape-and-reel code indicate production assembly and sourcing details useful to purchasing and manufacturing. This summary focuses on mechanical and ordering context to speed procurement, thermal planning, and footprint verification. For sourcing and official documentation consult IC Manufacturer. Engineers will use the package and ordering details during layout and supply-chain qualification.

QCA-8386-1-DRQFN172-MT-00-0 Technical Specifications

QCA-8386-1-DRQFN172-MT-00-0 Key Features

• High pin count allows dense I/O mapping and complex system integration while minimizing board real estate compared with larger multi-chip alternatives.
• DRQFN package gives a low-profile solution that improves thermal transfer to PCB and simplifies heatsink or thermal via strategies.
• Tape-and-reel ordering code supports automated SMT lines and high-volume assembly, reducing handling time compared with tray-packed parts.
• Standard 0.50 mm pitch eases PCB footprint design and is compatible with common stencil and reflow parameters used in modern contract manufacturing.

Typical Applications

• Board-level integration where a high-pin-count IC in a low-profile package is needed for compact industrial controllers, enabling denser routing and reduced board area.
• High-volume manufacturing environments that require tape-and-reel packaging for automated pick-and-place and reflow assembly to lower per-unit assembly cost.
• Thermally-constrained systems where the exposed-pad DRQFN format supports direct PCB thermal dissipation through thermal vias and copper planes for improved reliability.
• Prototyping and production of multi-function modules where numerous I/Os and power domains must be routed efficiently across a single footprint for smaller enclosures.

QCA-8386-1-DRQFN172-MT-00-0 Advantages vs Typical Alternatives

The 172-pin DRQFN format offers a better pins-to-footprint ratio than equivalent BGA or larger QFP parts, helping designers fit more functionality into tighter envelopes. The DRQFN exposed pad provides superior thermal coupling to the PCB compared with plastic QFPs. Tape-and-reel ordering streamlines procurement and assembly for higher volumes, making this part more suitable for automated lines and lower per-unit assembly labor costs than tray-packed components.

QCA-8386-1-DRQFN172-MT-00-0 Brand Info

QCA model numbers are associated with Qualcomm Atheros product families focused on connectivity and mixed-signal ICs. The brand emphasizes integration, manufacturability, and broad ecosystem support for networking and communications modules. This part number follows the vendor??s naming and packaging conventions used across their silicon portfolio.

FAQ

What does DRQFN172 mean?

DRQFN172 designates a dual-row QFN package with 172 leads and an exposed thermal pad. It identifies the mechanical package family and pin count used for PCB footprint and assembly planning.

How should I prepare the PCB footprint?

Follow the manufacturer??s recommended land pattern for DRQFN-172, include a plated thermal via field under the exposed pad, and match the 0.50 mm pitch to standard SMT stencil and solder paste processes.

Is the part available in tape-and-reel?

Yes. The MT-00-0 suffix indicates tape-and-reel packaging intended for automated SMT assembly, which supports standard reel quantities for high-volume production.

What thermal design steps are typical?

Use an exposed-pad to PCB thermal pad with multiple thermal vias tied to internal or bottom copper planes. This improves heat spreading compared with leadframe-only packages.

How do I verify sourcing and authenticity?

Cross-check the full part number and tape-and-reel code with official supplier catalogs or the manufacturer??s authorized distributor listings to confirm availability, lead times, and lot traceability.