QCA-6436-0-NSP170B-SR-01-0 Wi-Fi Chipset (Wireless SoC) SR Package

QCA-6436-0-NSP170B-SR-01-0 Overview

The QCA-6436-0-NSP170B-SR-01-0 is a compact wireless combo module designed for embedded networking applications. It integrates dual-band Wi?Fi and Bluetooth connectivity to support higher throughput and lower latency in constrained designs. The module targets integration where board space, power efficiency, and robust RF performance matter most. For sourcing and manufacturer details visit IC Manufacturer.

QCA-6436-0-NSP170B-SR-01-0 Technical Specifications

QCA-6436-0-NSP170B-SR-01-0 Key Features

• Dual-band Wi?Fi for combined 2.4 GHz and 5 GHz operation, offering higher aggregate throughput and reduced congestion compared with single-band parts.
• 2×2 MU?MIMO capability to improve spatial efficiency and increase real-world throughput for multiple simultaneous clients.
• Bluetooth 5.0 support for lower power, improved range, and higher data rates relative to earlier Bluetooth generations.
• Compact surface-mount module format to simplify PCB integration and reduce time-to-market versus discrete RF front-end solutions.

Typical Applications

• Embedded routers and gateways where combined Wi?Fi and Bluetooth reduce board count and enable compact wireless stacks for residential or light industrial deployments.
• IoT edge devices that require dual-band Wi?Fi for high-throughput uplinks and Bluetooth for local device provisioning and sensor connectivity.
• Consumer electronics modules that demand a small footprint and multi-protocol wireless support for streaming, voice, and peripheral pairing use cases.
• Industrial control panels where extended temperature range and robust RF links help maintain connectivity in mixed-noise environments.

QCA-6436-0-NSP170B-SR-01-0 Advantages vs Typical Alternatives

The module combines dual-band Wi?Fi and Bluetooth in a single surface-mount package, which reduces board area and part count compared with using separate chips. The 2×2 MU?MIMO and 802.11ac support deliver higher aggregate throughput than single-stream solutions. The compact 17.0 mm footprint and standard module pinout make integration faster and more predictable. Overall, this design reduces layout complexity and shortens development cycles when compared to discrete RF and baseband alternatives.

QCA-6436-0-NSP170B-SR-01-0 Brand Info

QCA-6436-0-NSP170B-SR-01-0 is identified with the QCA family, the wireless product line historically associated with Qualcomm Atheros. The brand emphasizes RF performance, integrated wireless stacks, and design support for OEMs deploying Wi?Fi and Bluetooth in embedded systems.

FAQ

What interfaces does it expose?

Typical module interfaces include standard digital buses for host connectivity and control. Refer to the product sheet for the exact list of interfaces and pin assignments before PCB design.

Is there regulatory certification?

Certification status varies by module and region. Check the supplier’s documentation for current FCC, CE, or other regional approvals that apply to shipping finished products.

How is antenna connectivity handled?

The module supports external antenna connections via defined RF pads or connectors. Use the manufacturer antenna recommendations and matching network details to preserve RF performance.

What development resources are available?

Manufacturers commonly provide reference schematics, layout guidelines, and software stacks. Consult the vendor’s support portal for SDKs and integration notes that speed evaluation and bring-up.

Where to buy production quantities?

Contact authorized distributors or the module vendor for lead times and volume pricing. For critical designs, request lifecycle and long-term availability details from the supplier.