QCC-3096-0-WLNSP99-TR-06-0 Bluetooth Audio SoC Tape & Reel

QCC-3096-0-WLNSP99-TR-06-0 Overview

The QCC-3096-0-WLNSP99-TR-06-0 is presented as a compact audio wireless system device intended for modern consumer and portable audio designs. It focuses on higher integration to simplify board design and reduce component count. The part targets lightweight, low-power wireless audio endpoints and aims to deliver reliable connectivity with integrated audio processing. For full procurement and technical resources see IC Manufacturer.

QCC-3096-0-WLNSP99-TR-06-0 Technical Specifications

QCC-3096-0-WLNSP99-TR-06-0 Key Features

• Integrated wireless audio connectivity with on-chip audio processing to simplify peripheral count and speed time-to-market.
• Compact surface-mount package designed for automated assembly, which reduces manufacturing complexity and improves yield on volume runs.
• Low-power operational modes to extend battery life in portable products and cut thermal stress in compact enclosures.
• On-chip memory and DSP elements for local audio processing, enabling reduced external RAM and lower BOM cost.

QCC-3096-0-WLNSP99-TR-06-0 Advantages vs Typical Alternatives

This device offers higher integration and simpler board design compared with multi-chip solutions. It reduces the external component count and supports automated tape-and-reel assembly. For sourcing and assembly, the part is positioned to improve supply-side efficiency and lower production complexity relative to typical discrete designs.

Typical Applications

• True wireless stereo earbuds and headsets where integrated audio processing and compact packaging reduce overall module size and power draw during continuous playback.
• Portable Bluetooth speakers that need a small-footprint audio SoC to manage wireless connectivity, audio decoding, and low-power standby modes.
• Wearable audio devices that require reduced component count and robust audio processing while maintaining long battery life in a compact host.
• Consumer audio accessories including wireless dongles and adapters where simplified integration and tape-and-reel packaging support high-volume production.

QCC-3096-0-WLNSP99-TR-06-0 Brand Info

QCC-3096-0-WLNSP99-TR-06-0 aligns with the QCC line of wireless audio solutions from Qualcomm Technologies. The brand emphasizes integrated audio SoCs that target consumer and wearable markets with a focus on compact design, wireless performance, and production-ready packaging.

FAQ

What is the device intended for?

The part is intended for wireless audio endpoints such as earbuds, headsets, and portable speakers. It focuses on integration to reduce external components and streamline assembly in volume manufacturing.

How is the part supplied for production?

This component is supplied in a tape-and-reel format suitable for automated pick-and-place lines. Tape-and-reel packaging supports efficient handling and reduces manual tape cutting during assembly.

Does it include on-chip audio processing?

Yes. The device includes on-chip audio processing and DSP capabilities to offload common voice and music tasks from host controllers, which simplifies BOM and design effort.

What about power management?

The device supports low-power operational modes and single-supply operation to help extend battery life in portable devices and reduce thermal dissipation in small enclosures.

Where can engineers find detailed specs?

Engineers should consult the official datasheet and technical resources from the manufacturer for detailed electrical specifications, pinout, and regulatory compliance before final design and sourcing.