IM323S6G2XKMA1 Intelligent Power Module, 600V 30A, S6-Power DIP Package

  • Performs efficient signal processing, enabling accurate data conversion for measurement and control tasks.
  • Supports a wide operating temperature range, allowing stable performance in diverse environmental conditions.
  • Compact package design helps save board space, making it suitable for dense circuit layouts and portable devices.
  • Ideal for use in industrial automation systems, where precise data acquisition is essential for optimized operations.
  • Manufactured to ensure consistent performance over time, supporting dependable system operation in critical applications.
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IM323S6G2XKMA1 Overview

The IM323S6G2XKMA1 is a highly integrated semiconductor device engineered for demanding industrial and electronic applications. With a robust feature set, this component delivers reliable performance, energy efficiency, and versatility for a broad range of circuit designs. Its compact form factor and advanced packaging support high-density PCB layouts, making it ideal for modern automation, control, and power management systems. For sourcing and technical details, visit the IC Manufacturer.

IM323S6G2XKMA1 Technical Specifications

ParameterValue
Part NumberIM323S6G2XKMA1
Package / CasePG-VQFN-28-19
Mounting TypeSurface Mount
RoHS StatusRoHS Compliant
Number of Pins28
ECCNEAR99
Country of OriginChina
Lead Free StatusLead Free

IM323S6G2XKMA1 Key Features

  • Compliant with RoHS and lead-free standards, ensuring environmental safety and compatibility with global manufacturing requirements.
  • Compact PG-VQFN-28-19 package allows for high-density PCB placement, enabling smaller, lighter designs without sacrificing functionality.
  • Surface-mount construction streamlines automated assembly and enhances mechanical reliability compared to through-hole alternatives.
  • Robust 28-pin configuration provides versatility in circuit integration, supporting complex system topologies and higher design flexibility.

IM323S6G2XKMA1 Advantages vs Typical Alternatives

The IM323S6G2XKMA1 offers superior integration and reliability over many standard solutions, thanks to its advanced surface-mount package and compliance with global environmental standards. This device supports efficient assembly processes and high circuit density, reducing board space requirements and facilitating modern electronic designs. Its RoHS compliance further ensures suitability for international markets and environmentally conscious projects.

Typical Applications

  • Industrial automation systems: The device??s compact package and reliable surface-mount design make it ideal for use in programmable logic controllers (PLCs), motor control units, and sensor interfaces where robust performance is crucial.
  • Embedded control units: Suitable for integration into microcontroller-based subsystems, offering footprint efficiency for embedded hardware platforms.
  • Power management modules: Applicable in power regulation circuits or distribution boards, supporting stable operation in demanding environments.
  • Consumer and industrial electronics: Fits well in densely populated PCBs for devices such as instrumentation, measurement equipment, and control panels.

IM323S6G2XKMA1 Brand Info

The IM323S6G2XKMA1 stands as a testament to quality and innovation in semiconductor component design. Manufactured to meet stringent international standards, it offers designers a reliable foundation for a variety of applications demanding durability and compact integration. The product??s adherence to RoHS and lead-free directives reflects a commitment to environmental responsibility, while its versatile package supports both advanced and legacy system designs.

FAQ

What is the package type and pin count of the IM323S6G2XKMA1?

This device is supplied in a PG-VQFN-28-19 package and features 28 pins, making it suitable for high-density PCB layouts and complex integration across various applications.

Is the IM323S6G2XKMA1 RoHS compliant and lead-free?

Yes, the component is fully RoHS compliant and lead-free. These characteristics ensure environmental friendliness and compatibility with global manufacturing and regulatory standards.

What mounting method is recommended for this device?

The IM323S6G2XKMA1 is designed for surface-mount technology (SMT), which allows for efficient automated assembly, improved mechanical reliability, and space-saving PCB layouts.

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产品中间询盘

Which industries typically use this device?

Industries such as industrial automation, embedded systems, power management, and high-density consumer electronics commonly utilize this device due to its robust packaging and versatile features.

Where is the IM323S6G2XKMA1 manufactured, and what is its export classification?

This component is manufactured in China and classified under ECCN EAR99, indicating that it is not subject to specific export controls, facilitating straightforward international sourcing and distribution.

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