IRF7749L1TRPBF Overview
The IRF7749L1TRPBF is a high-efficiency MOSFET engineered for superior switching performance in demanding power management and load control applications. This N-channel device features low on-resistance and robust current handling, making it suitable for compact, high-performance electronic designs. Its advanced trench technology enables improved efficiency and thermal performance, which are vital for modern industrial and automotive systems. The component??s small PowerPAK SO-8 package supports dense PCB layouts and automated assembly. For reliability and consistent supply, the IRF7749L1TRPBF is RoHS-compliant and fully qualified for industrial use. IC Manufacturer
IRF7749L1TRPBF Technical Specifications
| Attribute | Value |
|---|---|
| Device Type | N-Channel MOSFET |
| Package | PowerPAK SO-8 |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Operating Temperature Range | -55??C to +150??C |
| Polarity | N-Channel |
| Technology | Trench MOSFET |
| Qualification | Industrial Grade |
IRF7749L1TRPBF Key Features
- Low on-resistance for reduced conduction losses, resulting in higher efficiency during switching operations.
- Advanced trench technology delivers enhanced current capability, supporting high-load environments with minimal heat generation.
- Compact PowerPAK SO-8 package allows for space-saving PCB designs and improved thermal management.
- Wide operating temperature range ensures reliable function in industrial and automotive conditions.
- Surface mount configuration simplifies automated assembly and promotes robust mechanical connection.
- RoHS compliance facilitates use in global markets with strict environmental regulations.
IRF7749L1TRPBF Advantages vs Typical Alternatives
This N-channel MOSFET offers a superior balance of low on-resistance, high current handling, and robust industrial qualification compared to standard alternatives. Its advanced trench structure maximizes efficiency and minimizes thermal stress, leading to greater reliability and longer operational life. These key attributes make it a go-to choice for engineers seeking high performance in compact, power-dense designs.
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Typical Applications
- Power management circuits in industrial equipment, where efficient load switching and thermal stability are critical for operational longevity and cost-effectiveness.
- Automotive electronic systems, including electric motor drives and control modules, that require robust MOSFETs for reliable performance under harsh conditions.
- DC-DC converters and voltage regulation modules, leveraging low RDS(on) for minimizing power losses in conversion processes.
- General-purpose load switching in compact devices, benefiting from surface mount design and high efficiency for space-constrained boards.
IRF7749L1TRPBF Brand Info
The IRF7749L1TRPBF is part of a renowned portfolio of power MOSFETs recognized for their reliability and advanced technology. Positioned for industrial and automotive applications, this device leverages cutting-edge trench architecture and a compact PowerPAK SO-8 package. The product is qualified for demanding environments and is compliant with major environmental directives, reflecting the brand??s commitment to quality, efficiency, and global standards in semiconductor manufacturing.
FAQ
What package type is used for the IRF7749L1TRPBF and why is it beneficial?
This device uses the PowerPAK SO-8 surface-mount package, which is valued for its compact footprint and excellent thermal performance. This packaging supports automated assembly, high-density layouts, and effective heat dissipation in power-dense designs.
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Is the IRF7749L1TRPBF suitable for automotive or industrial environments?
Yes, this MOSFET is industrial grade and qualified to operate across a wide temperature range, making it suitable for both automotive and industrial electronic applications that demand reliability in challenging environments.
What are the environmental compliance standards for this MOSFET?
The IRF7749L1TRPBF is RoHS compliant, ensuring it meets global environmental directive requirements. This allows manufacturers to use it in electronic assemblies distributed in regions with strict hazardous materials regulations.
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How does trench technology benefit the performance of this component?
Trench MOSFET technology reduces on-resistance and improves current handling, leading to lower power losses and enhanced efficiency. This makes the device particularly effective for high-frequency switching and power management tasks.
Can this MOSFET be used in automated board assembly processes?
Absolutely. The surface-mount PowerPAK SO-8 package is designed for compatibility with standard pick-and-place and reflow soldering processes, making it ideal for automated high-volume production environments.
