BGSA145GA10E6327XTSA1 Overview
The BGSA145GA10E6327XTSA1 is a highly integrated RF switch designed to deliver superior performance in demanding signal routing applications. Engineered for low insertion loss and high isolation, this component is an optimal choice for RF front-end modules and wireless communication systems. Its compact, surface-mount package simplifies PCB design, while robust switching capabilities ensure reliable operation in high-frequency environments. This solution is ideal for engineers and sourcing specialists seeking high-performance RF switching with a minimized footprint and streamlined integration. Discover more about its features and availability at IC Manufacturer.
BGSA145GA10E6327XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Product Category | RF Switch ICs |
| Number of Circuits | 1 |
| Switch Configuration | SP4T (Single Pole, Four Throw) |
| Operating Frequency | Up to 3.8 GHz |
| Package / Case | TSLP-10-2 |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Manufacturer Standard Lead Time | 8 Weeks |
BGSA145GA10E6327XTSA1 Key Features
- SP4T RF Switch: Supports single pole, four throw routing, enabling flexible signal path selection for complex RF architectures.
- High Frequency Operation: Handles frequencies up to 3.8 GHz, making it suitable for modern wireless communication, LTE, and multi-band systems.
- Compact Surface Mount Package: TSLP-10-2 footprint minimizes PCB space requirements, aiding high-density board designs.
- RoHS Compliance: Meets environmental standards for hazardous substances, ensuring suitability for global markets and reliable production sourcing.
- Single Chip Integration: Reduces component count and simplifies layout for RF front-ends, lowering BOM costs and assembly complexity.
BGSA145GA10E6327XTSA1 Advantages vs Typical Alternatives
This RF switch offers several advantages compared to conventional alternatives. Its SP4T configuration allows for versatile signal routing in multi-band and multi-antenna systems. The high operating frequency ensures compatibility with advanced wireless protocols, while the compact TSLP-10-2 package supports dense layouts. Robust compliance with RoHS standards further enhances its appeal for global product development and procurement.
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Typical Applications
- Wireless Communication Systems: Ideal for applications requiring high-frequency signal switching in LTE, 4G, and other modern RF infrastructures, supporting seamless connectivity and efficient signal routing.
- RF Front-End Modules: Frequently used in front-end designs to select between multiple antennas or signal paths, improving overall system flexibility and performance.
- Test and Measurement Equipment: Suitable for automated test setups where multiple RF paths must be managed or isolated during manufacturing or validation processes.
- Consumer Electronics: Enables advanced RF switching in smartphones, tablets, and IoT devices, helping designers meet stringent space and performance requirements.
BGSA145GA10E6327XTSA1 Brand Info
The BGSA145GA10E6327XTSA1 is manufactured with a focus on reliability, integration, and high-frequency performance. This product is part of a family of advanced RF switch ICs, designed to streamline signal routing in compact and sophisticated electronic systems. Its robust design, combined with RoHS compliance and industry-standard packaging, makes it a trusted solution for designers and procurement teams aiming for efficient, high-quality RF architectures.
FAQ
What type of RF switch configuration does this device support?
This device features a single pole, four throw (SP4T) configuration, allowing users to direct a single input signal to one of four possible outputs, which is ideal for multi-band or multi-antenna systems.
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Is the BGSA145GA10E6327XTSA1 suitable for high-frequency applications?
Yes, it supports operation up to 3.8 GHz, making it well-suited for modern wireless communications, test equipment, and RF modules requiring broad frequency coverage and reliable signal routing.
What are the benefits of the TSLP-10-2 package for PCB design?
The TSLP-10-2 package is a compact, surface-mount option that reduces the required PCB area. This enables higher component density, supports miniaturized device designs, and simplifies automated assembly processes.
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Is this device compliant with environmental regulations?
Yes, it is RoHS compliant, meaning it meets restrictions on hazardous substances, facilitating its use in products that must adhere to global environmental and safety standards.
How does this RF switch enhance system integration?
By combining multiple switching functions in a single chip, the device lowers the overall component count, reduces layout complexity, and helps engineers achieve streamlined, cost-effective RF front-end designs.
