BGS18MA12E6327XTSA1 RF Switch, SPDT, 1.8V, TSLP6-27 Package

  • Provides efficient switching for electronic circuits, enabling precise control in various designs.
  • Features a maximum voltage rating that supports operation in demanding power management applications.
  • Compact package size allows for board-space savings in space-constrained layouts.
  • Ideal for use in power supply modules, improving overall system efficiency and thermal management.
  • Manufactured to meet industry standards, ensuring consistent quality and dependable long-term operation.
SKU: BGS18MA12E6327XTSA1 Category: Brand:
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产品上方询盘

BGS18MA12E6327XTSA1 Overview

The BGS18MA12E6327XTSA1 is a high-performance RF switch designed for demanding wireless communication applications. This component integrates advanced RF switching technology in a compact, low-profile package, making it ideal for space-constrained designs in mobile and industrial environments. With a focus on low insertion loss and high isolation, it delivers reliable signal routing for modern multi-band devices. The device offers robust electrical performance for systems operating across a broad frequency range, ensuring minimal signal degradation and enhanced overall efficiency. IC Manufacturer

BGS18MA12E6327XTSA1 Technical Specifications

Parameter Value
Type RF Switch
Operating Frequency Range 400 MHz to 6 GHz
Number of Switches Single-Pole, Double-Throw (SPDT)
Insertion Loss Low (specific value per datasheet)
Isolation High (specific value per datasheet)
Control Voltage 1.3 V to 2.7 V
Package Type TSNP-8-2
Mounting Style Surface Mount (SMD/SMT)

BGS18MA12E6327XTSA1 Key Features

  • Wide frequency range from 400 MHz to 6 GHz enables compatibility with multiple wireless communication standards, supporting versatile system integration.
  • Low insertion loss ensures minimal signal attenuation, improving overall RF performance in complex architectures.
  • High isolation between switch paths reduces interference and enhances signal integrity, crucial for multi-band and multi-antenna designs.
  • Compact TSNP-8-2 package supports high-density layouts, saving valuable PCB space in portable and embedded systems.

BGS18MA12E6327XTSA1 Advantages vs Typical Alternatives

Compared to standard RF switches, this device offers a strategic blend of low insertion loss and high isolation, leading to improved signal clarity and reduced cross-talk. Its wide frequency range and small footprint streamline integration into advanced wireless modules and industrial equipment. The combination of surface-mount packaging and robust electrical performance provides reliability and ease of assembly, ensuring dependable operation in high-demand scenarios.

Typical Applications

  • Mobile communication devices benefit from this switch??s broad frequency coverage and efficient signal routing, supporting advanced features in smartphones and tablets while minimizing board space requirements.
  • Wireless infrastructure equipment, such as base stations and access points, utilize the component for reliable path selection and reduced signal loss across multiple bands.
  • Industrial IoT systems integrate this RF switch for flexible connectivity and robust performance in harsh environments, where signal integrity and reliability are critical.
  • Consumer electronics, including wearables and portable devices, leverage its compact size and high isolation to maintain effective RF performance in space-limited designs.

BGS18MA12E6327XTSA1 Brand Info

This product is engineered and manufactured by a leading semiconductor company renowned for innovation in RF switch technology. The BGS18MA12E6327XTSA1 represents a commitment to quality and performance, delivering a reliable solution tailored for high-frequency signal switching in both consumer and industrial markets. The device is supported by thorough documentation and quality assurance, reflecting the brand??s focus on enabling cutting-edge wireless solutions for global OEMs and design engineers.

FAQ

What is the main application area for this component?

This device is primarily used in RF signal routing within wireless communication systems, including mobile devices, wireless infrastructure, and IoT equipment. Its wide frequency range and high performance make it suitable for multi-standard designs.

What package type is offered for this device?

It is supplied in a compact TSNP-8-2 surface-mount package, which supports high-density PCB designs and helps reduce overall module size for modern electronic systems.

How does the device help maintain signal integrity in complex designs?

By offering low insertion loss and high isolation, it minimizes signal degradation and cross-talk, ensuring that RF paths remain clean and free from unwanted interference in multi-band applications.

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产品中间询盘

Can the switch be used in industrial environments?

Yes, its robust construction and reliable electrical characteristics make it suitable for industrial IoT and automation systems where stable high-frequency switching and PCB space efficiency are needed.

What control voltage range is required for switching operation?

The device operates with a control voltage from 1.3 V to 2.7 V, making it compatible with many standard logic levels found in wireless and embedded system designs.

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