BGS12SN6E6327XTSA1 RF Switch, SPDT, 20V, 6-Pin TSNP Package

  • Designed for current sensing applications, enabling accurate monitoring and control in electronic circuits.
  • Features a surface-mount package, which supports compact PCB layouts and efficient use of board space.
  • The BGS12SN6E6327XTSA1 is suitable for integration in industrial or consumer devices requiring precise signal measurement.
  • Well-suited for use in power management systems, aiding in effective energy distribution and device protection.
  • Manufactured to ensure consistent performance and long operational life in demanding environments.
SKU: BGS12SN6E6327XTSA1 Category: Brand:
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产品上方询盘

BGS12SN6E6327XTSA1 Overview

The BGS12SN6E6327XTSA1 is a high-performance RF switch designed for a broad range of wireless communication applications. Featuring advanced CMOS technology, this device offers excellent isolation and low insertion loss, making it ideal for RF signal routing in space-constrained designs. Its compact packaging allows for easy integration into modern electronic systems, while its reliable operation ensures long-term performance. With robust ESD protection and low power consumption, this switch is well-suited for portable devices and infrastructure equipment alike. For more details, visit IC Manufacturer.

BGS12SN6E6327XTSA1 Technical Specifications

Parameter Value
Technology CMOS
Function RF Switch
Configuration Single-Pole Double-Throw (SPDT)
Package Type TSLP-6-2
Number of Pins 6
Operating Voltage 1.3 V to 3.6 V
Operating Temperature Range -30??C to +85??C
ESD Protection High

BGS12SN6E6327XTSA1 Key Features

  • Low insertion loss enables efficient RF signal transmission with minimal attenuation, ensuring optimal system performance in demanding applications.
  • High isolation between signal paths reduces unwanted signal coupling, which is critical for maintaining signal integrity in multi-channel designs.
  • Compact TSLP-6-2 package allows for space-saving PCB layouts, supporting miniaturization efforts in portable and mobile devices.
  • Robust ESD protection safeguards the switch against electrostatic discharge events, enhancing long-term device reliability in harsh environments.

BGS12SN6E6327XTSA1 Advantages vs Typical Alternatives

Compared to standard RF switches, this device combines high isolation and low insertion loss in a compact form factor, benefiting both performance and board space efficiency. The use of CMOS technology ensures low power consumption and enhanced integration, while strong ESD protection further boosts reliability for mission-critical wireless and RF systems.

Typical Applications

  • RF signal routing in mobile handsets and tablets, where efficient signal switching and compact dimensions are essential for high-performance connectivity and device miniaturization.
  • Wireless communication modules, allowing designers to implement flexible antenna selection or band-switching functions with minimal board area.
  • Infrastructure base stations, where robust reliability and low insertion loss are crucial for maintaining clear and stable wireless links.
  • Test and measurement equipment, leveraging the switch??s high isolation and low loss to achieve precise RF signal path control in demanding laboratory environments.

BGS12SN6E6327XTSA1 Brand Info

The BGS12SN6E6327XTSA1 is manufactured by a leading supplier renowned for innovation in RF and wireless semiconductor solutions. This product reflects a commitment to quality and performance, delivering advanced CMOS-based switching technology in a highly integrated format. Its proven reliability and robust protection features make it a preferred choice for engineers seeking dependable RF switching solutions for both consumer and infrastructure electronics.

FAQ

What type of RF switch configuration does this device offer?

This device features a Single-Pole Double-Throw (SPDT) configuration, which allows one input to be selectively switched between two outputs. This is ideal for antenna switching or signal path selection in wireless systems.

What are the benefits of the TSLP-6-2 package used in this switch?

The TSLP-6-2 package minimizes board space requirements, making it well-suited for compact electronic designs. Its small footprint simplifies integration into densely populated PCBs commonly found in mobile and wireless devices.

How does the device ensure reliability in harsh operating conditions?

With robust ESD protection and a wide operating temperature range from -30??C to +85??C, the switch is engineered to withstand electrostatic discharge and environmental extremes, ensuring stable and long-lasting operation in diverse applications.

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产品中间询盘

What makes the low insertion loss important for RF applications?

Low insertion loss means the switch introduces minimal attenuation to the RF signal, preserving signal strength and quality. This is critical for maintaining high data throughput and reducing power loss in wireless communication systems.

Is this device suitable for use in portable wireless devices?

Yes, its low power consumption, compact packaging, and high integration make it an excellent fit for portable wireless devices such as smartphones, tablets, and wireless modules, where both performance and space efficiency are top priorities.

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