BGSX33MU16E6327XTSA1 Overview
The BGSX33MU16E6327XTSA1 is a highly integrated RF switch designed for demanding wireless and connectivity applications. This component offers robust signal routing capabilities, making it ideal for modern communication devices that require precise and efficient RF path control. With its advanced characteristics and compact design, it enables engineers to achieve optimal performance in space-constrained environments. Sourcing specialists will appreciate its reliability, standard compliance, and suitability for mass production contexts. For more information about sourcing and supply, visit IC Manufacturer.
BGSX33MU16E6327XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Product Category | RF Switch ICs |
| Switch Type | SP3T (Single Pole Triple Throw) |
| Number of Inputs | 1 |
| Number of Outputs | 3 |
| Package / Case | TSLP-16-2 |
| Mounting Style | Surface Mount (SMD/SMT) |
| Operating Temperature Range | -30??C to +85??C |
| Lead Free Status / RoHS Status | Lead-Free / RoHS Compliant |
| Manufacturer | Infineon Technologies |
BGSX33MU16E6327XTSA1 Key Features
- SP3T RF switch topology enables flexible signal routing, which is crucial for multi-band or multi-antenna systems in wireless devices.
- Surface-mount TSLP-16-2 package supports high-density PCB layouts, reducing overall solution size and simplifying assembly for manufacturers.
- Wide operating temperature range from -30??C to +85??C ensures reliable performance across diverse environmental conditions, making it suitable for both consumer and industrial applications.
- Lead-free and RoHS compliant status aligns with global environmental and safety standards, facilitating international product approvals and eco-friendly designs.
BGSX33MU16E6327XTSA1 Advantages vs Typical Alternatives
This RF switch stands out due to its compact TSLP-16-2 package and surface-mount design, allowing for efficient integration in dense PCB layouts. Its SP3T configuration maximizes signal flexibility compared to single-path switches, while compliance with lead-free and RoHS regulations ensures long-term sustainability and global market access. The wide temperature range further adds to its reliability in varied application environments, making it a superior choice for demanding wireless designs.
🔥 Best-Selling Products
Typical Applications
- Cellular baseband platforms, where efficient RF path switching between antennas or bands is required for optimal signal performance and reduced board space.
- Wireless communication modules, enabling multiple frequency selection or antenna diversity in compact form factors.
- IoT devices that demand reliable RF switching for connectivity and network access in varied temperature environments.
- Consumer electronics such as smartphones, tablets, and wearables, benefitting from the component??s integration and regulatory compliance.
BGSX33MU16E6327XTSA1 Brand Info
Manufactured by Infineon Technologies, this RF switch IC reflects the brand??s commitment to advanced semiconductor solutions for connectivity and wireless signal management. Infineon??s portfolio is recognized for reliability, innovation, and adherence to international quality standards. The BGSX33MU16E6327XTSA1 is positioned to support high-volume manufacturing needs, offering robust performance in line with Infineon??s reputation for excellence in RF and wireless components.
FAQ
What is the switching configuration of this device?
This component features a Single Pole Triple Throw (SP3T) configuration, allowing one input to connect to three different outputs. This provides enhanced signal routing flexibility in RF applications compared to standard single-path switches.
🌟 Featured Products
-

“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-

QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-

0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-

1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
What package type does the product use and why is it beneficial?
The device is housed in a TSLP-16-2 surface-mount package. This package format enables high-density layout designs, saving PCB space and supporting automated assembly processes for volume manufacturing.
Is the device compliant with environmental and safety standards?
Yes, it is lead-free and RoHS compliant, meeting global environmental requirements. This ensures that the component can be used in products that must adhere to strict environmental regulations and market restrictions.
📩 Contact Us
In which temperature range can this switch operate reliably?
The device supports an operating temperature range from -30??C to +85??C. This broad range ensures stable performance in both consumer and industrial environments, offering design flexibility and reliability.
What are some typical use cases for this RF switch?
Key applications include cellular baseband platforms, wireless communication modules, IoT devices, and consumer electronics. It is especially suited for scenarios requiring compact, reliable, and flexible RF signal routing solutions.





