BGSA13GN10E6327XTSA1 Overview
The BGSA13GN10E6327XTSA1 is a compact RF switch designed for demanding wireless and communication applications. Engineered for high performance, this device features advanced signal routing and low insertion loss. Its integration into modern RF front-end modules supports enhanced connectivity, making it suitable for industrial, automotive, and consumer electronics sectors. The component??s small footprint and efficient switching characteristics streamline system design and support robust signal integrity, ensuring optimal operation in complex environments. For more details, visit IC Manufacturer.
BGSA13GN10E6327XTSA1 Technical Specifications
| Parameter | Value |
|---|---|
| Type | RF Switch |
| Number of Channels | Single Pole, Triple Throw (SP3T) |
| Operating Frequency Range | Up to 6 GHz |
| Package Type | TSNP-10 |
| Mounting Style | Surface Mount (SMD/SMT) |
| Control Interface | GPIO |
| ESD Protection | Up to 2 kV HBM |
| Lead-Free Status | RoHS Compliant |
BGSA13GN10E6327XTSA1 Key Features
- Supports frequencies up to 6 GHz, enabling compatibility with a wide range of modern RF applications and wireless communication standards.
- Single-pole triple-throw (SP3T) configuration provides versatile signal routing, which is critical for multi-band and multi-mode system designs.
- Integrated ESD protection up to 2 kV HBM enhances device reliability in harsh environments, reducing risk of damage from handling or transient events.
- Compact TSNP-10 package with surface mount technology allows for high-density PCB layouts and efficient use of board space, facilitating miniaturized system designs.
BGSA13GN10E6327XTSA1 Advantages vs Typical Alternatives
This RF switch stands out due to its high-frequency operation and robust ESD protection, which are essential for modern wireless modules. The combination of a compact footprint and versatile SP3T switching simplifies integration and increases reliability compared to standard alternatives, supporting efficient and flexible signal management in advanced RF systems.
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Typical Applications
- Wireless communication modules: The device??s broad frequency range and SP3T configuration make it ideal for base stations, mobile devices, and IoT modules requiring reliable and efficient RF routing.
- Automotive telematics: Its robust ESD protection and compact design suit automotive environments, supporting infotainment, navigation, and connectivity systems.
- Industrial automation: Used in smart factory equipment and wireless sensor networks where high performance and durability are mandatory.
- Consumer electronics: Perfect for smartphones, tablets, and other portable devices needing compact, high-frequency RF switches for antenna selection and signal switching.
BGSA13GN10E6327XTSA1 Brand Info
The BGSA13GN10E6327XTSA1 is part of a family of high-performance RF switches recognized for their reliability and integration capabilities. This product leverages advanced process technology to deliver low insertion loss and robust signal integrity while meeting stringent environmental and regulatory standards. Its RoHS compliance and support for surface-mount assembly reflect a commitment to quality and manufacturability for high-volume applications in diverse industries.
FAQ
What type of RF switch configuration does the BGSA13GN10E6327XTSA1 provide?
This device features a single-pole triple-throw (SP3T) configuration, allowing it to route one input to any of three outputs. This flexibility is essential for multi-band or multi-antenna systems where signal path selection is required.
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What is the maximum operating frequency supported?
The BGSA13GN10E6327XTSA1 supports operation up to 6 GHz, making it suitable for a wide range of wireless communication protocols and RF front-end designs that demand broad frequency coverage.
How does the integrated ESD protection benefit system reliability?
With ESD protection up to 2 kV HBM, the device is safeguarded against electrostatic discharge events during handling or operation. This enhances overall system robustness, especially in environments susceptible to ESD-related failures.
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Why is the TSNP-10 package advantageous for compact designs?
The TSNP-10 package offers a small footprint ideal for space-constrained applications. Its surface-mount format supports automated assembly, reducing manufacturing complexity and enabling denser PCB layouts in portable and embedded systems.
Is the BGSA13GN10E6327XTSA1 compliant with environmental regulations?
Yes, it is RoHS compliant and lead-free, supporting manufacturers?? requirements for environmentally friendly and sustainable electronics production without compromising performance or reliability.
