BGSA12UGL8E6327XTSA1 RF Switch IC, SP12T, Ultra Miniature Package ÿ Model BGSA12UGL8E6327XTSA1

  • Performs efficient signal amplification, ensuring accurate data transmission in sensitive electronic circuits.
  • Low standby current improves energy savings, enabling longer operational life in portable devices.
  • Compact package type conserves board space, supporting high-density designs and flexible layout options.
  • Ideal for integration in automated monitoring systems, where reliable signal processing is essential for performance.
  • Manufactured to meet standard quality protocols, minimizing risk of failure in critical applications.
SKU: BGSA12UGL8E6327XTSA1 Category: Brand:
Infineon logo
产品上方询盘

BGSA12UGL8E6327XTSA1 Overview

The BGSA12UGL8E6327XTSA1 is a highly integrated RF switch designed for advanced electronic systems requiring precise signal routing and low insertion loss. With its compact 8-XLLGA package and robust performance, this device is optimized for demanding wireless communication and RF front-end applications. The BGSA12UGL8E6327XTSA1 delivers reliable switching capability, making it an ideal choice for engineers seeking a balance of performance, size, and integration. For more technical resources, please visit IC Manufacturer.

BGSA12UGL8E6327XTSA1 Technical Specifications

Parameter Value
Part Number BGSA12UGL8E6327XTSA1
Function RF Switch
Number of Switches Dual SPDT
Package 8-XLLGA (1.1×1.1 mm)
Mounting Style Surface Mount (SMD/SMT)
RoHS Status Compliant
Lead Free Status Lead Free
Operating Temperature -40??C to +85??C

BGSA12UGL8E6327XTSA1 Key Features

  • Highly integrated dual SPDT RF switch configuration offers flexible signal routing for multi-band and multi-mode wireless systems.
  • Compact 8-XLLGA package (1.1×1.1 mm) enables space-saving PCB layouts, beneficial for mobile and IoT device designs where board space is at a premium.
  • Surface-mount design ensures compatibility with automated PCB assembly processes, reducing manufacturing complexity and increasing throughput.
  • RoHS and lead-free compliance make this device suitable for environmentally sensitive applications and global manufacturing standards.

BGSA12UGL8E6327XTSA1 Advantages vs Typical Alternatives

This RF switch stands out due to its integration of dual SPDT functionality in a miniature 8-XLLGA package, which streamlines board designs and minimizes space requirements. Its surface-mount capability and compliance with RoHS and lead-free standards promote easier assembly and global market compatibility. These benefits, combined with robust operating temperature range, make it a highly reliable and versatile solution compared to typical alternatives.

Typical Applications

  • Wireless communication systems where precise RF signal routing is required, such as smartphones, tablets, and portable modems, benefit from the dual SPDT configuration??s flexibility and integration.
  • IoT devices and modules, where component size and power efficiency are crucial, take advantage of the compact footprint and efficient switching performance.
  • RF front-end circuits in base stations and communication infrastructure equipment require reliable, low-loss switches for optimal signal integrity.
  • Consumer electronics that integrate multiple wireless protocols, such as Bluetooth and Wi-Fi, rely on robust RF switches to support seamless connectivity and coexistence.

BGSA12UGL8E6327XTSA1 Brand Info

The BGSA12UGL8E6327XTSA1 is offered by a leading manufacturer renowned for innovative RF semiconductor solutions. This device exemplifies the brand??s commitment to advancing miniaturization and integration in wireless and communication electronics. With a focus on quality, compliance, and reliable performance, the BGSA12UGL8E6327XTSA1 is engineered to meet the evolving needs of high-volume, high-performance industrial and consumer applications.

FAQ

What mounting method is recommended for the BGSA12UGL8E6327XTSA1?

This RF switch is designed for surface-mount technology (SMD/SMT), allowing for efficient and automated placement during PCB assembly. This enables faster manufacturing cycles and supports high-volume production environments.

Is the BGSA12UGL8E6327XTSA1 compliant with environmental regulations?

Yes, the device conforms to RoHS requirements and is lead-free, making it suitable for environmentally conscious designs and ensuring compliance with global industry standards for hazardous substances.

What is the package size of the BGSA12UGL8E6327XTSA1?

It is housed in an ultra-compact 8-XLLGA package, measuring just 1.1 x 1.1 mm. This small footprint is particularly valuable in applications where PCB real estate is limited or miniaturization is a priority.

📩 Contact Us

产品中间询盘

Which temperature range can the BGSA12UGL8E6327XTSA1 operate within?

The device is rated for operation from -40??C to +85??C, supporting reliable functionality in both industrial and consumer environments with varying ambient conditions.

What are the main advantages of using this RF switch in wireless systems?

Key benefits include flexible dual SPDT switching, compact package size, surface-mount compatibility, and compliance with global environmental standards, all of which contribute to efficient design, reliable performance, and easier integration into modern RF systems.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?