CYW89570CFFBGT Overview
The CYW89570CFFBGT is a high-performance, highly integrated device engineered for demanding industrial and commercial electronics. Designed to support robust data connectivity and efficient system integration, this component streamlines implementation in networking, IoT, and embedded applications. Its advanced features and optimized architecture deliver reliable operation and low power consumption, making it an excellent choice for engineers seeking superior functionality and longevity. For more detailed specifications and sourcing options, visit IC Manufacturer.
CYW89570CFFBGT Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYW89570CFFBGT |
| Mounting Type | Surface Mount |
| Package / Case | 196-TFBGA |
| RoHS Status | RoHS Compliant |
| Operating Temperature Range | -40??C to 105??C |
| Number of Pins | 196 |
| Lead Free Status | Lead Free |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
CYW89570CFFBGT Key Features
- Supports surface mount technology, enabling streamlined PCB assembly and increased manufacturing efficiency.
- Wide operating temperature range from -40??C to 105??C ensures reliable performance in harsh industrial environments.
- Packaged in a compact 196-TFBGA, allowing for high-density board layouts and efficient use of space.
- RoHS compliant and lead-free, meeting stringent environmental and safety standards required for modern electronics.
CYW89570CFFBGT Advantages vs Typical Alternatives
Compared to typical alternatives, the CYW89570CFFBGT offers a combination of robust environmental tolerance, compact BGA packaging, and RoHS compliance, making it suitable for applications with strict reliability and footprint requirements. Its extended temperature support and optimized integration contribute to dependable operation where other solutions may fall short.
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Typical Applications
- Industrial networking equipment, where consistent connectivity and reliable operation across extended temperature ranges are essential for automation and process control systems.
- Embedded computing platforms that require compact, high-density solutions with strong environmental compliance for mission-critical tasks.
- Internet of Things (IoT) gateways and modules demanding long-term reliability and robust performance in both commercial and industrial deployments.
- Communication infrastructure devices, benefiting from RoHS compliance and reduced board space requirements while maintaining high standards of quality.
CYW89570CFFBGT Brand Info
The CYW89570CFFBGT represents a specialized solution from a manufacturer recognized for delivering reliable and innovative components. It features a high pin-count BGA package and adheres to industry standards for environmental safety and long-term durability. This device is engineered to meet the rigorous demands of modern electronic systems, offering designers a dependable choice for advanced connectivity and integration needs.
FAQ
What is the primary packaging type used for this device?
The device utilizes a 196-TFBGA (Thin Fine-Pitch Ball Grid Array) package, which is well-suited to applications where board space and assembly precision are critical. This packaging supports automated surface mounting for efficient manufacturing.
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Is this component suitable for harsh industrial environments?
Yes, it is rated for operation from -40??C to 105??C, making it an excellent choice for industrial and commercial environments that experience wide temperature fluctuations or challenging conditions.
Does the CYW89570CFFBGT comply with RoHS standards?
Absolutely. The device is RoHS compliant and lead-free, ensuring it meets the current industry requirements for environmental safety and hazardous substance restrictions.
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How does the moisture sensitivity level affect handling?
With an MSL rating of 3 (168 hours), this device should be handled and stored appropriately to prevent moisture ingress prior to solder reflow, following standard best practices for BGA components.
What kind of applications can benefit most from this device?
The device is particularly well-suited for industrial automation, embedded computing, IoT gateways, and networking equipment where high reliability, compact footprint, and strict compliance with safety standards are necessary.
