CYW89310BUBGTXTMA1 Bluetooth SoC Module, Wireless Controller, BGA Package

  • Provides wireless connectivity, enabling integration into various devices that require robust communication features.
  • Model CYW89310BUBGTXTMA1 supports advanced Bluetooth technology, which helps improve data transfer efficiency.
  • Compact package design allows for space-efficient PCB layouts and is suitable for small form factor applications.
  • Ideal for smart home devices, where reliable wireless performance enhances user control and device automation.
  • Manufactured with quality assurance steps to support consistent operation in demanding environments.
SKU: CYW89310BUBGTXTMA1 Category: Brand:
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产品上方询盘

CYW89310BUBGTXTMA1 Overview

The CYW89310BUBGTXTMA1 is a highly integrated, surface-mount wireless communication module engineered for demanding industrial and commercial applications. Featuring advanced connectivity solutions and robust performance, this device is designed to streamline the integration of wireless capabilities into embedded systems. Its compact 56-VFBGA package enables space-efficient PCB layouts, while the RoHS-compliant construction ensures environmental compatibility. The CYW89310BUBGTXTMA1 supports a range of wireless protocols, making it an optimal solution for engineers seeking reliable and versatile connectivity in modern electronic designs. For more details, please visit IC Manufacturer.

CYW89310BUBGTXTMA1 Technical Specifications

Parameter Value
Manufacturer Part Number CYW89310BUBGTXTMA1
Package / Case 56-VFBGA
Mounting Type Surface Mount
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Product Category RF Transceiver Modules
Application Wireless Communication
Module Type Bluetooth, Wi-Fi Supported
Operating Temperature Range -40??C to +85??C

CYW89310BUBGTXTMA1 Key Features

  • Dual-mode wireless capability supports both Bluetooth and Wi-Fi standards, enabling seamless connectivity across a broad spectrum of industrial and consumer devices.
  • Compact 56-VFBGA package design allows for integration into space-constrained applications without sacrificing performance or reliability.
  • Wide operating temperature range from -40??C to +85??C ensures stable operation in harsh industrial environments and automotive systems.
  • Surface mount format simplifies manufacturing processes and improves assembly efficiency for high-volume PCB production.

CYW89310BUBGTXTMA1 Advantages vs Typical Alternatives

This module stands out due to its highly integrated wireless functionality and robust thermal endurance, providing reliable connectivity even under challenging conditions. The surface mount 56-VFBGA package ensures ease of assembly, while RoHS compliance demonstrates environmental responsibility. Compared to typical alternatives, its dual wireless protocol support and industrial-grade temperature range deliver a superior balance of flexibility and dependability for embedded applications.

Typical Applications

  • Industrial automation systems: Enables wireless control and monitoring of machinery, sensors, and process equipment in factory environments. Its robust wireless support and industrial-grade temperature specification make it ideal for these scenarios.
  • Consumer electronics: Integrates seamlessly into smart home devices, wearables, and personal gadgets requiring reliable Bluetooth and Wi-Fi connectivity for enhanced user experiences.
  • Automotive telematics: Supports secure and efficient data communication within vehicle infotainment, diagnostics, and fleet management systems, even across extended temperature ranges.
  • Medical devices: Facilitates wireless data transfer and device management in healthcare equipment, benefiting from its compact form factor and compliance with industry standards.

CYW89310BUBGTXTMA1 Brand Info

The CYW89310BUBGTXTMA1 is part of a trusted portfolio of wireless communication modules recognized for their integration, reliability, and performance. This solution exemplifies commitment to delivering advanced connectivity tailored for industrial, automotive, and high-reliability embedded applications. Its combination of compact packaging, environmental compliance, and support for both Bluetooth and Wi-Fi protocols positions it as a preferred choice among OEMs and system integrators seeking robust wireless solutions.

FAQ

What package type does the CYW89310BUBGTXTMA1 use and why is it beneficial?

This device utilizes a 56-VFBGA (Very Fine Ball Grid Array) package, which allows for a compact footprint and high pin density. This package is advantageous for engineers designing space-constrained PCBs while requiring robust electrical connections and efficient thermal performance.

Is the CYW89310BUBGTXTMA1 suitable for use in harsh environments?

Yes, the module offers an operating temperature range from -40??C to +85??C, making it well-suited for deployment in industrial, automotive, and other environments where wide temperature tolerance and reliable wireless communication are essential.

What wireless protocols are supported by the CYW89310BUBGTXTMA1?

This module supports both Bluetooth and Wi-Fi protocols, enabling versatile wireless connectivity for a variety of embedded and IoT applications. Its dual-mode support simplifies integration into products requiring multiple communication standards.

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产品中间询盘

How does RoHS compliance benefit manufacturers using this module?

RoHS compliance ensures that the device meets environmental and safety regulations by restricting hazardous substances in its construction. This simplifies global market access and supports manufacturers in meeting corporate sustainability and regulatory goals.

What applications benefit most from choosing the CYW89310BUBGTXTMA1?

Applications in industrial automation, automotive telematics, consumer electronics, and medical devices benefit significantly from its dual wireless support, robust environmental ratings, and compact surface mount package, enabling engineers to deliver reliable, space-efficient, and standards-compliant wireless solutions.

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