CYW88570DCFFBGT Overview
The CYW88570DCFFBGT is a highly integrated IC designed for demanding wireless connectivity applications. Leveraging advanced semiconductor technology, this device offers robust performance and reliability for industrial and commercial designs that require seamless wireless communication. Its compact BGA package and advanced features make it ideal for space-constrained projects where performance and integration are critical. For sourcing and detailed technical support, connect with IC Manufacturer.
CYW88570DCFFBGT Technical Specifications
| Part Number | CYW88570DCFFBGT |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 196-VFBGA |
| Operating Temperature Range | -40??C to 85??C |
| Packaging | Tray |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| ECCN | 5A992C |
| Lead Free Status | Lead Free |
CYW88570DCFFBGT Key Features
- Highly integrated BGA package minimizes board space, simplifying layout for dense wireless modules.
- Wide operating temperature range (-40??C to 85??C) ensures stable performance in industrial and harsh environments.
- RoHS compliance and lead-free construction support environmental and safety requirements for global markets.
- Surface mount design accelerates automated assembly, improving production efficiency and yield.
CYW88570DCFFBGT Advantages vs Typical Alternatives
This device offers key advantages over typical alternatives, including robust environmental compliance, a space-saving 196-VFBGA package, and reliable surface mount compatibility. Its extended temperature range and MSL 3 rating enhance durability and operational reliability, making it an excellent choice for high-performance wireless and embedded systems.
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Typical Applications
- Wireless communication modules in industrial automation, where robust operation and compact form factor are essential for system integration.
- Consumer electronic devices needing reliable wireless connectivity in a compact, energy-efficient package.
- Smart home gateways and IoT hubs that demand long-term reliability and compliance with lead-free and RoHS standards.
- Embedded systems operating in extended temperature environments, ensuring consistent wireless performance in both commercial and industrial settings.
CYW88570DCFFBGT Brand Info
The CYW88570DCFFBGT reflects the manufacturer??s commitment to innovation in high-integration wireless ICs. This product is engineered to deliver reliable connectivity, compactness, and compliance with strict industry standards. Its advanced packaging and environmental ratings position it as a preferred solution for OEMs and system designers seeking dependable wireless solutions for industrial and commercial deployments.
FAQ
What packaging format is available for the CYW88570DCFFBGT?
The device comes in a 196-VFBGA package, which is well-suited for designs prioritizing compactness and high pin-count connectivity. It is supplied in tray format, facilitating efficient handling and assembly in automated manufacturing environments.
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Is the CYW88570DCFFBGT compliant with environmental standards?
Yes, the component is RoHS compliant and lead-free, ensuring it meets stringent environmental and safety regulations for global electronics manufacturing and deployment.
What is the recommended operating temperature range for this device?
The CYW88570DCFFBGT is specified for operation between -40??C and 85??C, making it suitable for both industrial and commercial applications that may experience wide ambient temperature variations.
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How does the moisture sensitivity level (MSL) affect storage and assembly?
It has an MSL rating of 3 (168 hours), which means it can withstand exposure to ambient room conditions for up to 168 hours before reflow soldering. Proper storage and handling are recommended to prevent moisture-related defects during assembly.
What applications are best suited for the CYW88570DCFFBGT?
This IC is ideal for wireless communication modules, smart home devices, IoT gateways, and other embedded systems that require a small footprint, reliability, and compliance with environmental standards. Its robust design supports use in both consumer and industrial settings.
