CYW89510DBUBGTXTMA1 Bluetooth 5.2 SoC Module, Automotive, UBGA Package

  • Provides wireless connectivity, enabling seamless communication for embedded systems and IoT devices.
  • Supports Bluetooth functionality, which ensures efficient data transmission between compatible electronic components.
  • Integrated in a compact package, allowing for board-space savings and flexible design in space-constrained applications.
  • Ideal for smart home products, delivering dependable wireless performance in connected environments.
  • Manufactured to meet quality standards, ensuring consistent operation in a variety of conditions.
SKU: CYW89510DBUBGTXTMA1 Category: Brand:
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产品上方询盘

CYW89510DBUBGTXTMA1 Overview

The CYW89510DBUBGTXTMA1 is a highly integrated chip solution engineered for advanced wireless connectivity in demanding industrial and commercial environments. Offering robust performance and reliability, this device is tailored for applications requiring seamless data transmission, low power consumption, and extended operational stability. With a comprehensive feature set and compatibility with modern protocols, it ensures smooth integration into complex system architectures. The product stands out for its optimized design, supporting high-density deployments and scalable connectivity. For more product options and sourcing, visit IC Manufacturer.

CYW89510DBUBGTXTMA1 Technical Specifications

Parameter Value
Product Category RF Transceiver ICs
Package / Case UBGA-120
Mounting Style Surface Mount
Operating Temperature Range -40??C to 105??C
Number of Pins 120
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) MSL3 – 168 Hours
Lead Free Status Lead Free

CYW89510DBUBGTXTMA1 Key Features

  • High Integration: Combines multiple RF functions in a compact UBGA-120 package, enabling streamlined PCB designs and reducing component count.
  • Wide Operating Temperature: Supports robust operation from -40??C to 105??C, ideal for harsh industrial environments needing reliability across temperature extremes.
  • RoHS Compliance: Lead-free and environmentally responsible, simplifying adoption in markets with strict environmental regulations.
  • Surface Mount Technology: Designed for automated assembly, supporting high-volume manufacturing with consistent quality and efficient production workflows.
  • Extended Moisture Sensitivity Level: Rated at MSL3 (168 hours), allowing flexible handling during assembly without compromising device integrity.

CYW89510DBUBGTXTMA1 Advantages vs Typical Alternatives

This RF transceiver IC distinguishes itself with its high integration and broad temperature range, delivering reliable performance where alternatives may fall short. Its compliance with RoHS and lead-free directives ensures environmental compatibility, while the MSL3 rating enhances handling flexibility during production. The surface-mount UBGA-120 package further optimizes board space and simplifies automated assembly, making it an excellent choice for complex, high-density designs.

Typical Applications

  • Industrial Automation Systems: The device is well-suited for wireless communication modules in automation equipment, offering robust connectivity and long-term stability even in challenging factory environments.
  • Smart Infrastructure: Ideal for smart building controls and sensor networks requiring reliable RF performance and compact integration.
  • Networking Equipment: Used in routers, gateways, and access points where efficient data transmission and compliance with modern standards are essential.
  • Consumer Electronics: Supports advanced wireless features in home automation or multimedia devices needing low power and high reliability.

CYW89510DBUBGTXTMA1 Brand Info

The CYW89510DBUBGTXTMA1 is part of a distinguished portfolio of RF transceiver ICs, recognized for dependable wireless connectivity and superior integration. The brand behind this solution is committed to advancing connectivity technologies, providing products engineered for efficiency and reliability in demanding environments. This device, with its compact UBGA-120 package and surface-mount design, exemplifies the brand??s focus on enabling scalable, robust solutions for industrial, networking, and consumer electronics applications.

FAQ

What is the package type and pin count of the CYW89510DBUBGTXTMA1?

This device comes in a UBGA-120 package, featuring 120 pins. Such a configuration is optimized for compact PCB layouts and allows efficient integration into high-density designs, supporting advanced system requirements.

Is the CYW89510DBUBGTXTMA1 compliant with environmental regulations?

Yes, it is RoHS compliant and lead-free, which means it adheres to current environmental standards. This compliance simplifies the approval process for products targeting international markets with strict environmental policies.

What is the operating temperature range supported by this IC?

The CYW89510DBUBGTXTMA1 is rated for operation from -40??C to 105??C. This wide temperature range makes it suitable for both industrial and commercial applications where temperature stability is critical for system reliability.

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产品中间询盘

How does the moisture sensitivity rating affect assembly?

With an MSL3 (168 hours) moisture sensitivity level, the device can withstand up to 168 hours of exposure to ambient conditions before reflow soldering. This provides flexibility in manufacturing processes, reducing risks related to moisture-induced damage.

What mounting style does the CYW89510DBUBGTXTMA1 support?

The IC is designed for surface mount technology (SMT), enabling efficient, automated placement during PCB assembly. This supports high-volume production runs and consistent build quality in modern electronics manufacturing.

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