CYW89550CUBGTXTMA1 Wi-Fi Bluetooth Combo IC, Wireless Module, UBGA Package

  • Provides wireless connectivity, enabling seamless data transfer for embedded systems and IoT devices.
  • Supports multiple communication protocols, allowing integration into diverse networking environments with minimal complexity.
  • Compact package design saves board space, enabling easier integration into space-constrained applications.
  • Suited for home automation products, where it enables efficient device communication and remote control functions.
  • Manufactured to meet industry standards, ensuring consistent performance and dependable operation in various conditions.
SKU: CYW89550CUBGTXTMA1 Category: Brand:
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产品上方询盘

CYW89550CUBGTXTMA1 Overview

The CYW89550CUBGTXTMA1 is a high-performance, industrial-grade integrated circuit designed for robust wireless connectivity applications. Engineered to deliver reliable performance in demanding environments, this advanced device supports wireless communication protocols and offers versatile integration options for embedded systems. With its compact package and extended temperature range, it is suitable for modern industrial automation, IoT infrastructure, and commercial electronics requiring stable wireless links and efficient data transfer. For more details and sourcing, visit IC Manufacturer.

CYW89550CUBGTXTMA1 Technical Specifications

Parameter Value
Manufacturer Part Number CYW89550CUBGTXTMA1
Mounting Type Surface Mount
Operating Temperature Range -40??C to 85??C
Package / Case UBGA-123
Number of Pins 123
Moisture Sensitivity Level (MSL) 3 (168 Hours)
RoHS Status RoHS Compliant
Applications Wireless Communication

CYW89550CUBGTXTMA1 Key Features

  • Extended temperature range from -40??C to 85??C ensures dependable operation in harsh industrial and outdoor environments.
  • Compact UBGA-123 package enables high-density board layouts and efficient design integration for space-constrained systems.
  • RoHS compliance supports environmentally friendly designs and regulatory conformity in global markets.
  • Surface mount technology streamlines manufacturing and enhances reliability by reducing mechanical stress and improving electrical performance in assembled products.

CYW89550CUBGTXTMA1 Advantages vs Typical Alternatives

Compared to typical wireless IC alternatives, this device offers improved reliability under extreme temperature conditions and supports efficient integration thanks to its small UBGA-123 footprint. Its RoHS compliance and surface mount format further simplify assembly and global deployment, while the robust design ensures stable wireless performance in industrial and commercial environments.

Typical Applications

  • Industrial wireless communication modules: Enables reliable data links for factory automation, sensor networks, and industrial control systems where environmental conditions can fluctuate and robust connectivity is critical.
  • IoT infrastructure devices: Integrates into gateway, sensor, or asset tracking nodes requiring compact, high-reliability wireless solutions for smart city or remote monitoring deployments.
  • Commercial electronics: Suitable for wireless modules in point-of-sale terminals, handheld devices, or vending machines demanding consistent performance across wide temperature ranges.
  • Embedded systems development: Ideal for engineers designing custom platforms that need a small form-factor, surface-mounted wireless IC with proven industrial-grade reliability.

CYW89550CUBGTXTMA1 Brand Info

The CYW89550CUBGTXTMA1 represents a class of wireless communication solutions developed for demanding industrial and commercial use cases. With its robust design, extended temperature capabilities, and compact UBGA-123 package, this IC meets the needs of modern connectivity applications. The product??s RoHS compliance and surface mount form factor reflect a focus on both sustainability and ease of integration in manufacturing workflows.

FAQ

What is the recommended operating temperature range for CYW89550CUBGTXTMA1?

The device is rated for operation between -40??C and 85??C. This makes it suitable for both industrial and outdoor applications where temperature fluctuations are common and reliability is essential.

Which package type does CYW89550CUBGTXTMA1 use, and how does it benefit PCB design?

This IC is offered in a UBGA-123 package. The compact ball grid array format supports high-density PCB layouts and minimizes board space, which is beneficial for applications where space is at a premium.

Is this component compliant with environmental regulations?

Yes, it is RoHS compliant. This ensures that the product can be used in markets and end applications where environmental and safety standards require the reduction of hazardous substances in electronics manufacturing.

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产品中间询盘

What are the key mounting and assembly considerations?

CYW89550CUBGTXTMA1 is designed for surface mount technology (SMT), which facilitates automated assembly processes. SMT also improves mechanical stability and electrical performance in finished products, making it a practical choice for mass production.

What are the main application areas for this device?

Its primary application areas include industrial wireless modules, IoT infrastructure devices, commercial wireless systems, and embedded electronics that require compact, reliable, and high-performance wireless connectivity solutions.

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