CYW89510BUBGTXTMA1 Overview
The CYW89510BUBGTXTMA1 is a high-performance integrated circuit designed for demanding wireless connectivity applications. With robust features and advanced process technology, it enables seamless integration into modern electronic systems. Its compact package and reliable electrical characteristics make it an excellent choice for industrial, automotive, and consumer device designs. For engineers seeking consistent quality and proven performance in wireless IC solutions, this component delivers a competitive edge. Discover more at IC Manufacturer.
CYW89510BUBGTXTMA1 Technical Specifications
| Attribute | Value |
|---|---|
| Manufacturer Part Number | CYW89510BUBGTXTMA1 |
| Category | RF Integrated Circuits |
| Package / Case | 196-UFBGA, FCBGA |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40??C to 105??C |
| Packaging | Tray |
| Subcategory | RF Transceivers |
| Lead Free Status / RoHS Status | Lead Free / RoHS Compliant |
CYW89510BUBGTXTMA1 Key Features
- Advanced surface mount package enables high-density board layouts and streamlined manufacturing processes.
- Wide operating temperature range from -40??C to 105??C supports use in industrial and automotive environments, ensuring reliability under harsh conditions.
- RoHS compliance and lead-free status make it suitable for global markets and environmentally conscious applications.
- High pin count (196-UFBGA, FCBGA) supports complex RF and wireless system integration for enhanced functionality.
CYW89510BUBGTXTMA1 Advantages vs Typical Alternatives
Compared to standard RF transceivers, this device provides superior integration through its high pin-count BGA package and broad temperature tolerance. These features enhance durability, ease PCB layout, and reduce overall system complexity. Its compliance with RoHS standards further ensures suitability for international designs and environmentally regulated applications, giving engineers a reliable and forward-compatible choice.
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Typical Applications
- Industrial wireless communication systems: The device??s robust temperature range and package make it ideal for factory automation, machine-to-machine communication, and sensor networks in challenging environments.
- Automotive wireless modules: Designed for reliability in vehicular settings, supporting infotainment, telematics, and V2X connectivity.
- Consumer electronics: Suitable for integration in smart home devices, wireless audio, and personal electronics where compactness and performance are critical.
- Embedded RF platforms: Enables wireless connectivity in embedded computing, gateways, and IoT nodes requiring high integration and long-term reliability.
CYW89510BUBGTXTMA1 Brand Info
The CYW89510BUBGTXTMA1 is a specialized part within the RF Integrated Circuits category, engineered for high-reliability wireless transmission. The product leverages advanced packaging and compliance standards to deliver dependable connectivity across a wide spectrum of industrial and commercial applications. Its manufacturer is recognized for innovation in wireless IC solutions, supporting both quality and regulatory demands for next-generation electronics.
FAQ
What type of package does the CYW89510BUBGTXTMA1 use?
This device utilizes a 196-UFBGA (Ultra Fine Ball Grid Array) or FCBGA (Flip Chip Ball Grid Array) package, offering high pin density and superior electrical performance. This enables advanced integration and efficient board space utilization.
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Is the CYW89510BUBGTXTMA1 suitable for automotive environments?
Yes, it supports an operating temperature range from -40??C to 105??C, making it well-suited for automotive applications where components must function reliably under extreme conditions.
Does the CYW89510BUBGTXTMA1 comply with environmental regulations?
The device is lead-free and RoHS compliant, meeting international standards for hazardous substance restrictions and making it appropriate for global product designs.
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What are the main application areas for this component?
It is ideal for industrial wireless communication, automotive modules, consumer electronics, and embedded RF platforms, thanks to its robust design and broad integration capabilities.
How is the CYW89510BUBGTXTMA1 typically supplied to manufacturers?
The component is provided in tray packaging, which is common for high-pin-count BGA devices and ensures safe handling and automated assembly compatibility in mass production environments.





