CYW20829B0P4TAI200XUMA1 Bluetooth SoC Module, QFN Package, Wireless MCU

  • Enables wireless Bluetooth connectivity, allowing seamless device communication in various embedded systems.
  • Supports Bluetooth Low Energy, which helps reduce power consumption for battery-powered applications.
  • Compact surface-mount package saves board space, making it suitable for dense PCB layouts.
  • Ideal for smart home controls, enhancing remote operation and automation reliability.
  • Manufactured with strict quality standards to ensure consistent performance in demanding environments.
SKU: CYW20829B0P4TAI200XUMA1 Category: Brand:
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产品上方询盘

CYW20829B0P4TAI200XUMA1 Overview

The CYW20829B0P4TAI200XUMA1 is an advanced Bluetooth System-on-Chip (SoC) designed to deliver robust wireless connectivity and efficient processing for industrial and commercial IoT applications. This device integrates Bluetooth Low Energy (LE) capabilities with a powerful core architecture, providing reliable data transmission and enhanced control features. Its compact QFN-40 package and extended industrial temperature range make it ideal for demanding environments. With its optimized power consumption, the device is well-suited for battery-powered designs. For more details and sourcing, visit IC Manufacturer.

CYW20829B0P4TAI200XUMA1 Technical Specifications

Parameter Value
Wireless Protocol Bluetooth Low Energy (LE)
Core Architecture 32-bit
Operating Temperature Range -40??C to +105??C
Package Type QFN-40
Mounting Style Surface Mount
Core Supply Voltage 1.8V
Input/Output Supply Voltage 1.8V / 3.3V
RoHS Status Compliant
Number of Pins 40
Frequency Band 2.4 GHz ISM

CYW20829B0P4TAI200XUMA1 Key Features

  • Bluetooth Low Energy support enables low-power wireless communication, which is ideal for battery-operated industrial and IoT devices.
  • Industrial temperature range from -40??C to +105??C ensures reliable operation in harsh and demanding environments.
  • Compact QFN-40 package allows for efficient PCB design and integration into space-constrained applications.
  • Surface mount capability streamlines manufacturing and supports high-volume automated assembly processes.
  • Flexible supply voltage options (1.8V core, 1.8V/3.3V I/O) improve compatibility with various system designs.
  • RoHS compliance guarantees adherence to environmental and safety standards for global markets.

CYW20829B0P4TAI200XUMA1 Advantages vs Typical Alternatives

This device stands out due to its extended industrial temperature range and optimized low-power Bluetooth LE connectivity, making it more reliable in harsh conditions compared to standard SoCs. Its compact QFN-40 package and flexible supply voltage enhance design versatility, while RoHS compliance ensures global acceptance in environmentally regulated markets. These characteristics provide significant advantages in both performance and system integration.

Typical Applications

  • Industrial IoT sensor nodes??The device??s Bluetooth LE capability and industrial temperature range make it ideal for wireless sensor connectivity in factories, warehouses, and remote monitoring systems, ensuring reliable performance in challenging environments.
  • Smart building automation??Supports wireless control and monitoring of lighting, HVAC, and access systems, improving energy efficiency and operational flexibility.
  • Medical and health devices??Enables secure, low-power data transmission in portable health monitors and patient tracking solutions.
  • Asset tracking and logistics??Facilitates real-time location and status updates for goods in transit or storage, leveraging robust wireless connectivity.

CYW20829B0P4TAI200XUMA1 Brand Info

This product represents a highly integrated Bluetooth Low Energy solution within the manufacturer??s portfolio, targeting industrial-grade wireless applications. The CYW20829B0P4TAI200XUMA1 is engineered for reliability, energy efficiency, and ease of integration, making it a preferred choice for designers building next-generation IoT and automation systems. Its compliance with global safety and environmental standards further strengthens its appeal for mass-market deployments.

FAQ

What makes the CYW20829B0P4TAI200XUMA1 suitable for industrial applications?

The wide operating temperature range of -40??C to +105??C, along with Bluetooth LE support and robust surface-mount packaging, ensures dependable performance in challenging industrial environments. Its compliance with key industry standards also enhances suitability for long-term deployment.

Can this device be used in battery-powered designs?

Yes, the optimized Bluetooth Low Energy protocol and efficient core architecture make the device ideal for power-sensitive applications. Its low current consumption extends battery life in portable and remote wireless products.

What package type and pin count does this SoC feature?

It is offered in a QFN-40 package, featuring 40 pins. This compact and low-profile format supports automated PCB assembly and facilitates dense board layouts.

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产品中间询盘

How does the supply voltage flexibility benefit designers?

With support for both 1.8V and 3.3V I/O supply voltages, the device can be easily integrated into mixed-voltage systems, enhancing design flexibility and compatibility with various components in a system architecture.

Is the CYW20829B0P4TAI200XUMA1 compliant with environmental standards?

Yes, it is RoHS compliant, ensuring that it meets global environmental and safety regulations, which is crucial for developing products intended for worldwide distribution and environmentally conscious markets.

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