CYW88510CUBGTXTMA1 Overview
The CYW88510CUBGTXTMA1 is a sophisticated wireless communications IC designed to deliver robust and flexible connectivity in demanding industrial and commercial environments. It supports advanced wireless protocols and is engineered for seamless integration into a wide range of embedded systems. This device is an optimal choice for engineers seeking reliable, high-performance wireless solutions that streamline product development and deployment. For more detailed information and sourcing options, visit the IC Manufacturer.
CYW88510CUBGTXTMA1 Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYW88510CUBGTXTMA1 |
| Device Type | RF Integrated Circuit |
| Mounting Type | Surface Mount |
| Package / Case | LGA-116 |
| Operating Temperature Range | -40??C to 85??C |
| Data Rate | High-Speed Wireless |
| Protocol Support | Advanced Wireless Protocols |
| RoHS Status | RoHS Compliant |
CYW88510CUBGTXTMA1 Key Features
- Highly integrated RF solution, reducing external component count and simplifying PCB layout for faster time-to-market.
- Supports advanced wireless protocols, enabling flexible connectivity for diverse industrial and commercial applications.
- Surface mount LGA-116 package allows for streamlined automated assembly and space-saving in dense designs.
- Wide operating temperature range ensures reliable performance in harsh and demanding environments.
CYW88510CUBGTXTMA1 Advantages vs Typical Alternatives
Engineers benefit from this device??s high degree of integration, which minimizes design complexity and enhances reliability compared to typical multi-chip solutions. The broad protocol support and robust temperature tolerance make it an ideal choice for mission-critical wireless applications where consistent performance and simplified system design are essential.
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Typical Applications
- Industrial wireless modules, where dependable RF communication and ruggedness are essential for automation and monitoring systems in harsh factory environments.
- Commercial IoT devices that require reliable, high-speed wireless connectivity for data exchange and remote management.
- Embedded control systems used in building automation, where integration and protocol flexibility enable versatile deployment.
- Consumer electronics seeking compact, robust wireless connectivity solutions to enable smart features and enhanced user experiences.
CYW88510CUBGTXTMA1 Brand Info
The CYW88510CUBGTXTMA1 represents a commitment to advanced wireless connectivity and integration from a leading industry brand. This product is designed to address the needs of engineers and system architects who require dependable, high-performance RF ICs for next-generation connected devices. Its combination of protocol versatility, rugged packaging, and ease of integration highlights the brand??s focus on innovation and quality in wireless semiconductor solutions.
FAQ
What packaging does the CYW88510CUBGTXTMA1 use, and why is it beneficial?
This device is supplied in a compact LGA-116 package, which supports surface mount technology. This packaging is ideal for automated assembly and helps designers save PCB space in dense layouts, especially in embedded and wireless module applications.
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Is the CYW88510CUBGTXTMA1 suitable for use in harsh industrial environments?
Yes, the device operates across a wide temperature range from -40??C to 85??C, making it well-suited for demanding industrial and commercial settings that may experience significant temperature fluctuations.
What types of wireless protocols can be supported by this IC?
The product is engineered to support advanced wireless protocols, enabling flexible connectivity options for a range of applications. This capability is particularly valuable for IoT, industrial automation, and embedded system designs.
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Does the CYW88510CUBGTXTMA1 comply with environmental regulations?
Yes, the device is RoHS compliant, ensuring it meets strict environmental and safety standards required by global electronics manufacturers and regulatory bodies.
How does this IC improve integration in embedded system designs?
The high level of integration reduces the need for external RF components, simplifying the overall system design. This leads to higher reliability, more compact solutions, and can significantly reduce time-to-market for new product developments.
