CYW88510DCUBGTXTMA1 Wi-Fi Bluetooth Combo Module, UQFN-91 Package

  • Enables wireless connectivity, allowing devices to communicate efficiently in short-range network environments.
  • Features a DCUBG package, offering a compact footprint that saves valuable board space in dense designs.
  • Low power consumption helps extend device battery life and reduces overall system thermal load.
  • Ideal for smart home products, providing seamless integration of various wireless-enabled components.
  • The CYW88510DCUBGTXTMA1 undergoes rigorous testing to ensure consistent performance in demanding conditions.
SKU: CYW88510DCUBGTXTMA1 Category: Brand:
Infineon logo
产品上方询盘

CYW88510DCUBGTXTMA1 Overview

The CYW88510DCUBGTXTMA1 is a highly integrated, advanced connectivity solution designed for demanding wireless applications. Engineered to deliver robust, high-speed wireless communication, this device is ideal for embedding Wi-Fi and Bluetooth functionality into industrial and commercial electronics. With its compact form factor and optimized feature set, it enables designers to implement reliable wireless links with minimal board space and power consumption. For organizations seeking a dependable and versatile wireless IC, the CYW88510DCUBGTXTMA1 stands out as a cost-efficient option. For more details, visit the IC Manufacturer.

CYW88510DCUBGTXTMA1 Technical Specifications

Parameter Value
Part Number CYW88510DCUBGTXTMA1
Device Type Wireless Communication IC
Connectivity Wi-Fi, Bluetooth
Mounting Type Surface Mount (SMD/SMT)
Package / Case VFBGA-143
RoHS Status RoHS Compliant
Operating Temperature Range -40??C to +85??C
Supply Voltage Specified per datasheet
Number of Pins 143
Special Function Integrated Wireless

CYW88510DCUBGTXTMA1 Key Features

  • Integrated Wi-Fi and Bluetooth support provides flexible wireless connectivity, enabling multi-protocol communication in a single device.
  • Compact VFBGA-143 package conserves PCB space, making it suitable for densely populated designs and portable equipment.
  • Robust operating temperature range from -40??C to +85??C ensures reliable function in harsh industrial and commercial environments.
  • RoHS compliance guarantees adherence to environmental standards, supporting green manufacturing initiatives.
  • Surface mount design streamlines automated assembly processes and improves mechanical stability in finished products.

CYW88510DCUBGTXTMA1 Advantages vs Typical Alternatives

This wireless communication IC offers significant advantages over standard alternatives by combining Wi-Fi and Bluetooth functionality within a single, compact package. Its wide operating temperature range and RoHS compliance enhance reliability and environmental sustainability. The surface mount format simplifies integration in automated production, reducing assembly costs and improving long-term durability in industrial deployments. These factors together make it a preferred choice for high-reliability wireless applications.

Typical Applications

  • Industrial automation systems requiring robust wireless connectivity between sensors, controllers, and monitoring equipment, especially in environments with strict space or power constraints.
  • Commercial IoT devices integrating Wi-Fi and Bluetooth for smart building management and asset tracking.
  • Medical instrumentation where secure, reliable wireless data transfer is essential for patient monitoring and diagnostic devices.
  • Consumer electronics, including smart appliances and handheld devices, that benefit from integrated multi-protocol wireless solutions.

CYW88510DCUBGTXTMA1 Brand Info

The CYW88510DCUBGTXTMA1 exemplifies the manufacturer??s commitment to delivering advanced semiconductor solutions for wireless connectivity. This product is engineered to facilitate the seamless integration of Wi-Fi and Bluetooth technologies into next-generation electronic systems. Its design reflects the brand??s emphasis on high performance, compactness, and robust environmental compliance, supporting diverse industrial and commercial applications worldwide.

FAQ

What package type is used for the CYW88510DCUBGTXTMA1 and why is it beneficial?

The device utilizes a VFBGA-143 package, which is a very thin fine-pitch ball grid array. This form factor is advantageous as it enables high-density component placement, saves PCB space, and supports automated assembly processes, making it ideal for compact and high-volume designs.

Is the CYW88510DCUBGTXTMA1 suitable for industrial temperature environments?

Yes, the device supports an operating temperature range from -40??C to +85??C. This wide range ensures reliable performance in both industrial and commercial environments, including those with challenging thermal conditions.

Does the CYW88510DCUBGTXTMA1 support RoHS environmental compliance?

Absolutely. The product is RoHS compliant, which means it does not contain hazardous substances restricted by environmental regulations. This supports eco-friendly manufacturing and product stewardship initiatives.

📩 Contact Us

产品中间询盘

What are the main connectivity options available with this device?

This IC provides integrated support for both Wi-Fi and Bluetooth protocols. This dual connectivity capability allows designers to create versatile wireless solutions for a wide range of applications, from IoT to industrial systems.

In what types of applications is the CYW88510DCUBGTXTMA1 typically used?

The device is commonly deployed in industrial automation, IoT endpoints, medical instrumentation, and consumer electronics. Its integrated wireless features, compact package, and robust reliability make it an excellent fit for applications demanding dependable and flexible wireless communication.

Application

, ,

Save cost and time

Fast global delivery

Original parts guaranteed

Expert after-sale support

Looking for a Better Price?