CYW55570MIUBGT Wi-Fi 6/Bluetooth Combo IC, LGA Package, Wireless Module

  • Provides wireless connectivity, enabling devices to communicate seamlessly within IoT or embedded systems.
  • Features a MIUBGT package, which supports a compact design and efficient use of board space in space-limited applications.
  • The compact package helps reduce overall device size, making it suitable for portable or densely packed electronics.
  • Ideal for smart home hubs, allowing reliable device networking and improved user convenience in connected environments.
  • Built to ensure consistent performance and stable operation in demanding or long-term usage scenarios.
SKU: CYW55570MIUBGT Category: Brand:
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CYW55570MIUBGT Overview

The CYW55570MIUBGT is a sophisticated wireless connectivity solution designed for demanding industrial and commercial applications. With advanced integration of Bluetooth and Wi-Fi technologies, this device delivers robust performance, energy efficiency, and streamlined connectivity for embedded systems. Its compact package and high level of functionality make it ideal for designs where board space and reliability are at a premium. The CYW55570MIUBGT stands out for its multi-protocol support, enabling seamless communication in a wide variety of use cases. For further details, visit IC Manufacturer.

CYW55570MIUBGT Technical Specifications

Parameter Value
Part Number CYW55570MIUBGT
Device Type Wireless Module
Connectivity Wi-Fi, Bluetooth
Package Module
Mounting Style Surface Mount
Operating Temperature Range -40??C to +85??C
Compliance RoHS
Application Segment Industrial, Commercial

CYW55570MIUBGT Key Features

  • Multi-protocol wireless support enables both Wi-Fi and Bluetooth connectivity, offering flexible integration into diverse system architectures and reducing the need for multiple modules.
  • Industrial temperature range from -40??C to +85??C ensures reliable performance in harsh environmental conditions, making it suitable for field-deployed and mission-critical applications.
  • Surface mount package streamlines assembly and optimizes board space, supporting high-density layouts in compact embedded designs.
  • RoHS compliance guarantees adherence to global environmental and safety standards, simplifying regulatory approval for end products.

CYW55570MIUBGT Advantages vs Typical Alternatives

Compared to standard wireless modules, this device offers a distinct edge with its dual Wi-Fi and Bluetooth support, wide industrial temperature operating range, and compact surface-mount form factor. These features combine to deliver higher reliability, streamlined integration, and robust multi-protocol communication in challenging industrial or commercial environments.

Typical Applications

  • Industrial IoT gateways and controllers ÿ Leverage the CYW55570MIUBGT??s robust wireless connectivity to aggregate sensor data and interface with factory automation systems, even under extreme temperature fluctuations.
  • Smart home and building automation ÿ Integrate seamless Wi-Fi and Bluetooth connections for intelligent lighting, HVAC controls, and access management systems in commercial and residential settings.
  • Medical and healthcare devices ÿ Enable wireless data transfer and device management while meeting strict reliability standards for patient monitoring or diagnostic equipment.
  • Retail and point-of-sale terminals ÿ Support fast, reliable peripheral communication and wireless payment processing in environments with high user traffic or electromagnetic interference.

CYW55570MIUBGT Brand Info

The CYW55570MIUBGT reflects the manufacturer??s commitment to delivering high-performance wireless modules tailored for industrial and commercial applications. Designed with a focus on reliability and regulatory compliance, it enables OEMs and system integrators to accelerate time to market for connected solutions. The device??s robust construction and versatile protocol support ensure it remains a trusted choice for engineers seeking proven wireless connectivity in modern embedded designs.

FAQ

What types of wireless connectivity does this device support?

This module supports both Wi-Fi and Bluetooth technologies, allowing for versatile integration in systems that require reliable short-range and long-range wireless communication. Its dual-protocol capability reduces design complexity and enables broad application coverage.

Is this module suitable for harsh industrial environments?

Yes, the CYW55570MIUBGT is designed to operate reliably within a temperature range of -40??C to +85??C, making it well suited for demanding industrial settings where temperature extremes are common. This ensures consistent performance even in mission-critical deployments.

What compliance certifications does the CYW55570MIUBGT meet?

The device is RoHS compliant, which means it adheres to strict environmental standards by restricting the use of hazardous substances. This compliance helps facilitate global market access and simplifies product certification processes for manufacturers.

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How does the surface mount packaging benefit design and manufacturing?

Surface mount packaging enables efficient automated assembly, reduces manual handling, and supports high-density PCB layouts. This not only streamlines manufacturing processes but also helps designers conserve valuable board space in compact applications.

Which application areas are ideal for integrating this wireless module?

The CYW55570MIUBGT is ideal for industrial IoT gateways, building automation, healthcare devices, and retail terminals. Its combination of wireless flexibility and rugged design allows it to be deployed in a wide range of embedded systems requiring reliable connectivity.

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