CYW4339XKWBGT Wi-Fi/Bluetooth Combo Chip, Wireless Module, WLBGA Package

  • Provides wireless connectivity, enabling seamless data transfer for embedded and IoT devices.
  • Supports multiple wireless protocols, ensuring flexible integration with diverse network environments.
  • Offered in a compact package, allowing for efficient use of board space in space-constrained designs.
  • Ideal for smart home systems, facilitating secure and stable device communication within connected environments.
  • Manufactured to meet standard industry reliability requirements, supporting consistent performance over time.
SKU: CYW4339XKWBGT Category: Brand:
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产品上方询盘

CYW4339XKWBGT Overview

The CYW4339XKWBGT is a high-performance wireless connectivity solution designed for industrial, commercial, and consumer applications. It integrates multiple wireless protocols into a single, compact package, enabling robust and reliable data communication. This device is engineered to deliver efficient wireless connectivity with minimal power consumption, making it ideal for space-constrained environments and battery-powered designs. Its advanced features support a wide range of IoT, embedded, and networking applications, ensuring seamless integration and dependable performance. For further details and sourcing, visit IC Manufacturer.

CYW4339XKWBGT Technical Specifications

Parameter Value
Device Type Wireless Communication Module
Wireless Protocols Wi-Fi, Bluetooth
Package / Case FBGA-124
Mounting Type Surface Mount
Operating Temperature Range -30??C to +85??C
Interface Multiple digital interfaces supported
RoHS Status RoHS Compliant
Supplier Device Package 124-VFBGA

CYW4339XKWBGT Key Features

  • Integrated support for both Wi-Fi and Bluetooth, enabling simultaneous wireless connectivity for high data throughput and flexible device communication.
  • Compact FBGA-124 package simplifies integration into space-constrained hardware designs, reducing PCB footprint while maintaining robust performance.
  • Wide operating temperature range from -30??C to +85??C ensures reliable operation in industrial and harsh environments.
  • RoHS compliance supports eco-friendly manufacturing and aligns with global environmental standards.

CYW4339XKWBGT Advantages vs Typical Alternatives

Compared to conventional wireless modules, this device combines multi-protocol support and industrial-grade reliability within a compact form factor. Its broad operating temperature range, high level of integration, and RoHS compliance provide enhanced versatility and durability, making it a preferred choice for demanding embedded and IoT designs that require reliable connectivity and long-term availability.

Typical Applications

  • Industrial IoT gateways and wireless sensor nodes, where robust multi-protocol connectivity and reliable operation across a wide temperature range are critical for continuous data collection and communication.
  • Consumer electronics requiring seamless Wi-Fi and Bluetooth integration for advanced user experiences and device interoperability.
  • Embedded systems and smart home devices, leveraging the module??s compact footprint and efficient wireless communication in space-limited designs.
  • Commercial networking equipment and point-of-sale terminals, benefiting from stable wireless connectivity and compliance with environmental directives.

CYW4339XKWBGT Brand Info

This wireless module represents a commitment to innovation and reliability in connectivity solutions. Designed to meet rigorous industrial and commercial standards, it reflects the brand??s focus on integrating advanced wireless technologies into a unified, space-saving package. The product is built to deliver consistent performance in diverse applications, supporting engineers and OEMs in developing high-quality wireless-enabled systems.

FAQ

What wireless communication protocols are supported by this device?

This module supports both Wi-Fi and Bluetooth protocols, allowing for flexible integration into systems that require either or both types of wireless connectivity. This dual-protocol capability is especially beneficial for IoT and embedded applications.

What packaging format is used for the device, and why is it important?

The device is offered in a 124-ball Fine Ball Grid Array (FBGA-124) package, which provides a compact footprint. This packaging is advantageous for high-density PCB designs and ensures reliable electrical performance and manufacturability.

Is the module suitable for industrial temperature ranges?

Yes, it is rated for operation between -30??C and +85??C, making it well-suited for industrial, commercial, and harsh environment applications that demand consistent wireless performance under varying temperature conditions.

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产品中间询盘

Does the product comply with environmental regulations?

The module is RoHS compliant, which means it meets the requirements for hazardous substances in electronic components. This compliance facilitates its use in environmentally responsible designs and global markets.

What are typical use cases for this wireless module?

Common applications include industrial IoT gateways, smart consumer electronics, embedded systems, and commercial networking devices. The integration of Wi-Fi and Bluetooth, along with a compact package and wide temperature support, enables broad usage across multiple sectors.

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