CYBL10461-68FNXIT Overview
The CYBL10461-68FNXIT is a sophisticated integrated circuit (IC) engineered for demanding industrial and commercial applications requiring advanced wireless communication and control. Designed for optimal integration and performance, it delivers robust connectivity in a compact package, making it suitable for space-constrained environments. This device stands out due to its reliable operation and tailored feature set, which supports efficient system design and deployment. With its high level of integration, it reduces component count and simplifies board layouts, enhancing overall system reliability. IC Manufacturer
CYBL10461-68FNXIT Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYBL10461-68FNXIT |
| Package / Case | 68-VFBGA |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40??C to +85??C |
| Interface | Integrated Wireless Connectivity |
| Voltage Supply | Supported per device specification |
| Core Functionality | Wireless Communication |
| RoHS Status | Compliant |
CYBL10461-68FNXIT Key Features
- Integrated wireless functionality enables streamlined design and reduces the need for external RF modules, resulting in a smaller PCB footprint.
- Wide operating temperature range from -40??C to +85??C allows deployment in harsh industrial and outdoor environments where robust performance is essential.
- Surface-mount VFBGA package supports high-density layouts and automated manufacturing, ensuring reliable assembly and consistent electrical performance.
- RoHS compliance ensures the component meets global environmental and safety standards, simplifying regulatory approval and eco-friendly product design.
CYBL10461-68FNXIT Advantages vs Typical Alternatives
Compared to conventional alternatives, this IC offers a higher degree of integration, reducing external component requirements and minimizing board complexity. Its robust wireless connectivity, paired with broad temperature tolerance, ensures reliable operation in challenging conditions. The compact VFBGA package enhances design flexibility, making it ideal for applications where space and reliability are critical related function words.
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Typical Applications
- Wireless sensor networks: Utilized for industrial automation and smart monitoring systems, enabling seamless data transmission and remote control in interconnected environments.
- Consumer electronics: Suitable for wireless-enabled devices requiring compact form factors and efficient communication capabilities.
- Medical equipment: Supports remote monitoring and wireless communication in portable or fixed medical devices, ensuring patient safety and system reliability.
- Building automation: Ideal for smart lighting, HVAC control, and access management systems that depend on stable wireless connectivity.
CYBL10461-68FNXIT Brand Info
The CYBL10461-68FNXIT is produced by a reputable manufacturer known for innovative IC solutions in wireless communication. This product exemplifies a strong commitment to quality and integration, offering a balance of performance, size, and reliability. Its design aligns with the needs of advanced industrial and commercial markets, delivering dependable functionality and compliance with international standards.
FAQ
What is the operating temperature range for the CYBL10461-68FNXIT?
This device is designed to function reliably across a wide temperature range from -40??C to +85??C, making it suitable for both industrial and outdoor applications where environmental conditions can vary significantly.
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What type of package does this IC utilize?
The CYBL10461-68FNXIT is housed in a 68-VFBGA (Very Fine Ball Grid Array) package, which is ideal for high-density, surface-mount circuit designs and allows for automated assembly processes.
Is the CYBL10461-68FNXIT compliant with environmental regulations?
Yes, this component is RoHS compliant, which means it meets global standards for the restriction of hazardous substances, supporting sustainable and environmentally friendly product development.
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What are the typical use cases for this device?
It is commonly employed in applications such as wireless sensor networks, consumer electronics, medical devices, and building automation systems, where reliable wireless communication and compact design are crucial.
How does this IC simplify system design?
Its high level of integration reduces the need for external RF modules and associated components, enabling simpler PCB layouts, lowering BOM costs, and improving overall system reliability and manufacturability.
