CYW55902IUBGTXTMA1 Bluetooth 5.4 SoC Module, QFN Package

CYW55902IUBGTXTMA1 Overview

The CYW55902IUBGTXTMA1 is a high-performance wireless communication module designed for applications demanding robust connectivity and advanced integration. Featuring support for multiple wireless standards, this component enables reliable data transfer, making it suitable for a wide spectrum of industrial, consumer, and IoT solutions. Its compact package and surface-mount design facilitate streamlined assembly and integration into modern electronic systems. Engineered for efficiency and compatibility, this device enhances wireless capabilities while providing stable and secure connections. Learn more about sourcing from IC Manufacturer for high-quality wireless IC supply.

CYW55902IUBGTXTMA1 Technical Specifications

CYW55902IUBGTXTMA1 Key Features

• Advanced Surface-Mount Package: The VFBGA-113 format ensures a compact footprint, simplifying PCB design and enabling high-density integration for space-constrained applications.
• Wide Operating Temperature Range: With support from -40??C to 85??C, this device performs reliably in harsh industrial environments, ensuring stable operation across varied applications.
• RoHS3 Compliance: Environmentally conscious design meets strict RoHS3 standards, making it suitable for global markets and eco-friendly product development.
• Industry-Standard Moisture Sensitivity Level: MSL 3 (168 hours) classification enhances manufacturability and storage, reducing risks of damage during reflow soldering.

CYW55902IUBGTXTMA1 Advantages vs Typical Alternatives

Compared to typical wireless modules, this solution stands out for its compact VFBGA-113 package, robust surface-mount compatibility, and extended operating temperature range. These attributes deliver higher reliability, easier integration, and improved durability in demanding industrial and commercial environments. Related function words such as ??integration,?? ??reliability,?? and ??compliance?? are key to its value proposition.

Typical Applications

• Wireless IoT Gateways: Ideal for integration into IoT gateway devices, the module’s advanced surface-mount packaging and robust temperature tolerance enable stable and secure wireless connectivity in both consumer and industrial IoT infrastructures. This facilitates seamless data aggregation and device management.
• Industrial Automation Systems: Its wide temperature range and compliance features support deployment in factory automation, robotics, and process control, where reliable wireless links are essential for operational uptime.
• Smart Home Devices: The compact footprint and RoHS3 compliance make it a strong choice for connected appliances, lighting, and security systems requiring efficient wireless communication.
• Consumer Electronics: The device can be used in wearable devices, smart health monitors, and entertainment systems, where integration ease and compliance with environmental standards are priorities.

CYW55902IUBGTXTMA1 Brand Info

The CYW55902IUBGTXTMA1 is engineered and supplied by a recognized leader in wireless communication technology. This model is a testament to the brand??s commitment to quality, reliability, and innovation in the connectivity domain. With a focus on advanced packaging, compliance, and operational flexibility, this product is targeted at engineers seeking dependable solutions for next-generation wireless designs. The product??s proven performance and availability make it a trusted choice for efficient, scalable, and compliant wireless integration projects.

FAQ

What is the packaging format of the CYW55902IUBGTXTMA1, and why is it important for integration?

This device uses the VFBGA-113 package, a compact ball grid array that enables high-density mounting. Such a format minimizes board space requirements and supports streamlined assembly in modern electronic designs, making it ideal for projects where space and integration density are critical.

What operating temperature range does this component support?

The module supports a broad operating temperature range from -40??C to 85??C. This ensures stable and reliable performance in both commercial and industrial environments, including those exposed to significant temperature fluctuations or harsh conditions.

Is the CYW55902IUBGTXTMA1 compliant with environmental standards?

Yes, it is RoHS3 compliant, meeting strict international requirements for the restriction of hazardous substances. This compliance makes it suitable for environmentally responsible projects and facilitates access to global markets that require adherence to these standards.

What is the device??s Moisture Sensitivity Level (MSL), and why does it matter?

The CYW55902IUBGTXTMA1 is rated at MSL 3 (168 hours), indicating that it can withstand standard assembly processes with proper handling. This classification is important for manufacturers, as it helps prevent moisture-induced damage during soldering, improving overall production yields and product reliability.

How available is the CYW55902IUBGTXTMA1 for sourcing and procurement?

This model is currently in stock, making it readily accessible for production needs. Its reliable availability helps reduce lead times and supports timely project development, which is crucial for maintaining competitive electronics manufacturing schedules.