CYW55502IUBGTXTMA1 Wi-Fi 6/Bluetooth Combo IC, LGA Package, Wireless Module

  • Provides wireless connectivity, enabling seamless communication between devices in embedded and IoT applications.
  • Features a compact package type that helps conserve valuable PCB space in dense hardware designs.
  • Reduces power consumption, supporting longer battery life for portable and energy-sensitive products.
  • Ideal for smart home systems, allowing efficient integration with sensors and controllers for automation tasks.
  • Manufactured to deliver consistent performance, supporting stable operation in demanding environments.
SKU: CYW55502IUBGTXTMA1 Category: Brand:
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产品上方询盘

CYW55502IUBGTXTMA1 Overview

The CYW55502IUBGTXTMA1 is an advanced wireless connectivity IC, engineered for robust integration in demanding industrial and commercial environments. This highly integrated solution streamlines wireless design by combining essential connectivity features with strong performance and reliability metrics. Ideal for next-generation IoT, automation, and communication systems, it supports secure, high-speed communication and flexible system design. Its compact form factor and industrial-grade reliability make it a preferred choice for engineers seeking reduced development times and enhanced connection stability. Learn more at IC Manufacturer.

CYW55502IUBGTXTMA1 Technical Specifications

Parameter Value
Product Category RF Transceiver ICs
Mounting Style Surface Mount
Package/Case UBGA-109
Operating Temperature Range -40??C to +85??C
Supply Voltage 3.3V
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Packaging Tray

CYW55502IUBGTXTMA1 Key Features

  • Highly integrated RF transceiver, minimizing the need for external components and reducing overall PCB footprint for space-constrained designs.
  • Industrial-grade temperature range (-40??C to +85??C) ensures reliable operation in harsh and demanding environments, supporting mission-critical applications.
  • Surface mount package (UBGA-109) streamlines automated assembly and promotes robust connections for high-volume manufacturing environments.
  • ROHS3 compliance supports environmentally responsible design and global regulatory requirements.

CYW55502IUBGTXTMA1 Advantages vs Typical Alternatives

This device stands out from typical RF transceiver ICs by combining industrial temperature tolerance with robust integration and a compact UBGA-109 package. Its ROHS3 compliance, surface mount capability, and reliable supply voltage ensure compatibility with modern, eco-conscious designs, reducing risk and simplifying qualification for global deployments. Related function words such as reliability, integration, and compliance are key differentiators.

Typical Applications

  • Industrial automation systems requiring stable, long-range wireless communication in environments with extreme temperature variation, ensuring seamless machine-to-machine connectivity and data integrity.
  • IoT gateways and edge devices where secure, high-performance RF transceivers are essential for aggregating sensor data and enabling smart infrastructure.
  • Consumer and commercial networking equipment that demands reliable surface mount solutions for space-efficient, high-volume manufacturing.
  • Embedded modules in smart building systems, supporting energy management, access control, and other wireless-enabled functions with robust performance.

CYW55502IUBGTXTMA1 Brand Info

This IC is part of a family of wireless connectivity solutions designed for industrial and commercial use, offering a blend of high integration and robust reliability. The product??s advanced packaging and compliance with global environmental standards support its adoption in cutting-edge wireless designs. Its design philosophy centers on seamless integration, system flexibility, and future-ready performance, making it a strategic choice for forward-thinking development teams.

FAQ

What type of applications is the CYW55502IUBGTXTMA1 best suited for?

This wireless IC is ideal for industrial automation, IoT, networking, and embedded systems that require robust RF performance, compact size, and reliable operation across a wide temperature range. Its compliance and packaging make it suitable for high-volume, environmentally conscious designs.

How does the device support reliable manufacturing processes?

The surface mount UBGA-109 package enables automated assembly lines to efficiently produce high-quality electronic assemblies, minimizing risk of connection failure and supporting large-scale production with consistent results.

What are the environmental and compliance highlights?

This device is ROHS3 compliant, ensuring it meets stringent global environmental regulations and is suitable for markets that require eco-friendly, lead-free manufacturing and supply chain practices.

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产品中间询盘

Can the CYW55502IUBGTXTMA1 operate in harsh conditions?

Yes, the IC is rated for operation from -40??C to +85??C, making it a dependable choice for industrial and commercial environments that experience significant temperature fluctuations or challenging operating conditions.

What packaging and shipping considerations should sourcing specialists note?

It ships in tray packaging and has a Moisture Sensitivity Level (MSL) of 3, which corresponds to a floor life of 168 hours. Proper handling and storage are recommended to maintain device integrity throughout the assembly process.

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