CYW55511IUBGTXTMA1 Overview
The CYW55511IUBGTXTMA1 is a high-performance integrated circuit designed for demanding wireless connectivity and communication applications. Engineered for industrial and commercial environments, this device delivers robust performance and reliability in a compact, surface-mount package. Its advanced technology supports sophisticated wireless functions and optimized power efficiency, making it a favored choice for engineers seeking a feature-rich solution. The part is ideally suited for integration into modern electronic systems that require dependable, scalable wireless connectivity. For additional supplier information, visit IC Manufacturer.
CYW55511IUBGTXTMA1 Technical Specifications
| Parameter | Value |
|---|---|
| Manufacturer Part Number | CYW55511IUBGTXTMA1 |
| Mounting Type | Surface Mount |
| Package/Case | 196-UFBGA, FCBGA |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Operating Temperature | -40??C ~ 85??C (TA) |
| Supplier Device Package | 196-FCBGA (8×8) |
| Series | * |
| Stock Availability | Yes |
CYW55511IUBGTXTMA1 Key Features
- Surface mount design ensures straightforward PCB integration, promoting compact layouts and simplified manufacturing processes.
- Wide operating temperature range from -40??C to 85??C enables reliable performance in industrial and harsh environments.
- 196-UFBGA, FCBGA compact package supports high-density board designs and helps reduce overall system footprint.
- Moisture Sensitivity Level 3 rating allows for standard reflow soldering practices and manageable storage requirements.
CYW55511IUBGTXTMA1 Advantages vs Typical Alternatives
The device stands out among similar wireless connectivity ICs due to its broad operating temperature range and industrial-grade reliability. Its compact FCBGA package allows for high-density integration, while the MSL 3 rating simplifies assembly and handling. These attributes result in higher system dependability and streamlined production compared to standard alternatives.
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Typical Applications
- Industrial wireless communication modules requiring robust, long-term operation in harsh settings benefit from the extended temperature range and durable packaging.
- Consumer electronics products that demand compact, high-density wireless solutions can utilize this device??s small FCBGA footprint.
- Embedded systems for IoT devices, where reliable connectivity and efficient assembly are critical to overall design goals.
- Networking equipment and gateways, where industrial-grade performance and ease of integration are essential for scalable deployments.
CYW55511IUBGTXTMA1 Brand Info
This device is a member of the CYW55511 series, designed to deliver advanced wireless communication capabilities. The product leverages proven manufacturing quality and is supported by a reputable supply chain. With its compact package and industrial temperature support, it provides engineers with a dependable, flexible building block for a wide range of wireless-enabled systems.
FAQ
What is the main benefit of the surface mount package for the CYW55511IUBGTXTMA1?
The surface mount package allows for efficient automated assembly, reducing manual intervention and supporting high-volume manufacturing. This packaging style also enables more compact PCB layouts, which is valuable in space-constrained designs.
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Can this device operate in harsh environments?
Yes, the CYW55511IUBGTXTMA1 supports an operating temperature range from -40??C to 85??C, making it well-suited for use in industrial and other demanding environments where temperature extremes are common.
What advantages does the MSL 3 rating bring to manufacturing?
Moisture Sensitivity Level 3 means the device can withstand exposure to ambient room conditions for up to 168 hours before reflow soldering. This simplifies logistics and storage, helping manufacturers manage inventory with less risk of device degradation.
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Which applications are best suited for this wireless IC?
Applications such as industrial wireless modules, IoT embedded systems, consumer electronics, and networking equipment are ideal due to the device??s robust design, compact package, and reliable performance.
How does the compact FCBGA package affect system design?
The 196-FCBGA package allows for higher component density and reduced board area, enabling designers to create smaller, lighter products while maintaining strong wireless performance and system reliability.
