CYW55501IUBGTXTMA1 Wi-Fi 6/Bluetooth Combo Chip, Networking, FBGA Package

  • Enables wireless connectivity, allowing devices to communicate seamlessly in networked environments.
  • Supports multiple wireless protocols, providing flexibility for integration in diverse system designs.
  • Offered in a compact package type, reducing board space requirements and simplifying hardware layout.
  • Ideal for use in smart home devices, enhancing control and automation capabilities for users.
  • Manufactured to meet strict quality standards, ensuring dependable operation in demanding conditions.
SKU: CYW55501IUBGTXTMA1 Category: Brand:
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产品上方询盘

CYW55501IUBGTXTMA1 Overview

The CYW55501IUBGTXTMA1 is a highly integrated wireless communication solution designed for demanding industrial and commercial applications. This device combines advanced wireless connectivity and robust performance in a compact package, enabling streamlined design and efficient system integration. With its versatile features, it addresses the requirements of modern IoT, automation, and embedded systems. The module??s architecture supports reliable operation across a broad temperature range, making it ideal for environments where consistent connectivity and durability are essential. Learn more at IC Manufacturer.

CYW55501IUBGTXTMA1 Technical Specifications

Attribute Value
Part Number CYW55501IUBGTXTMA1
Device Type Wireless Module
Core Function Wireless Communication
Operating Temperature Range -40??C to 85??C
Package Type Module
Mounting Style Surface Mount
RoHS Compliance Yes
Supplier Infineon Technologies

CYW55501IUBGTXTMA1 Key Features

  • Designed for industrial temperature ranges, ensuring reliable wireless operation from -40??C to 85??C for harsh environments.
  • Surface mount packaging allows for straightforward assembly in high-volume production, reducing time to market and manufacturing complexity.
  • RoHS compliance supports environmentally friendly product development and global regulatory requirements.
  • Highly integrated module form factor minimizes board space and simplifies system-level design for embedded wireless applications.

CYW55501IUBGTXTMA1 Advantages vs Typical Alternatives

The CYW55501IUBGTXTMA1 stands out due to its robust industrial temperature specification, integrated wireless functionality, and surface mount design. Compared to standard alternatives, this device provides enhanced durability, improved ease of integration, and regulatory compliance, making it a preferred choice for professionals seeking reliable and efficient wireless modules for industrial and commercial systems.

Typical Applications

  • Industrial automation systems requiring secure and reliable wireless connectivity in environments with wide temperature fluctuations, such as factory floors or outdoor installations.
  • Internet of Things (IoT) edge devices that need compact wireless modules for data collection, monitoring, and control in smart infrastructure.
  • Embedded systems in transportation or logistics that operate under rigorous conditions and demand continuous wireless communication.
  • Commercial building automation and control solutions where integrated wireless functionality and compliance with environmental standards are essential.

CYW55501IUBGTXTMA1 Brand Info

The CYW55501IUBGTXTMA1 is manufactured by Infineon Technologies, a global leader in semiconductor solutions for industrial, automotive, and IoT applications. This product reflects Infineon’s commitment to high-quality, reliable wireless solutions tailored for modern electronics. Its design supports a broad range of industrial and commercial use cases, providing integrators and engineers with a trusted component for next-generation wireless systems.

FAQ

What is the primary use case for the CYW55501IUBGTXTMA1 wireless module?

This module is tailored for industrial and commercial applications where reliable wireless communication is essential. Its robust design makes it suitable for environments demanding wide temperature operation, consistent connectivity, and high integration.

Is the CYW55501IUBGTXTMA1 compliant with environmental standards?

Yes, the device is RoHS compliant, supporting environmentally responsible product development and ensuring compatibility with global regulations concerning hazardous substances in electronic equipment.

What benefits does the surface mount design of CYW55501IUBGTXTMA1 provide?

The surface mount packaging allows for efficient automated assembly, reducing manufacturing complexity and costs. It also enables compact PCB layouts, which is important for miniaturized or high-density designs.

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产品中间询盘

Who supplies the CYW55501IUBGTXTMA1 wireless module?

This module is supplied by Infineon Technologies, a recognized provider of advanced semiconductor products for industrial, automotive, and IoT markets.

Can the CYW55501IUBGTXTMA1 be used in harsh temperature environments?

Yes, it is designed to operate reliably across a temperature range of -40??C to 85??C, making it well-suited for demanding industrial and outdoor applications where temperature resilience is required.

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