CYW20822P4EPI040XUMA1 Bluetooth 5.0 Module, SoC, QFN Package

  • Enables wireless connectivity for seamless device communication in embedded and IoT applications.
  • Supports Bluetooth technology, which allows for efficient data transfer and low-latency connections.
  • Features a compact package design that conserves PCB space and simplifies integration into small devices.
  • Ideal for smart home products, providing stable wireless links for sensors and controllers.
  • Manufactured with industry-standard quality controls to help ensure dependable operation in various environments.
SKU: CYW20822P4EPI040XUMA1 Category: Brand:
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CYW20822P4EPI040XUMA1 Overview

The CYW20822P4EPI040XUMA1 is a highly integrated Bluetooth system-on-chip designed for industrial and commercial wireless connectivity applications. This device leverages advanced RF technology to deliver reliable Bluetooth Low Energy (BLE) and Bluetooth Classic communication, making it suitable for a wide range of wireless designs. Its compact QFN-40 package supports efficient PCB layouts and space-constrained installations. With robust performance and flexible interfaces, this part streamlines the development of connected devices. For sourcing and technical details, visit IC Manufacturer.

CYW20822P4EPI040XUMA1 Technical Specifications

Attribute Value
Device Type Bluetooth SoC
Package QFN-40
Mounting Style Surface Mount
Operating Temperature Range -40??C to +105??C
Bluetooth Version Bluetooth 5.2
Core Architecture 32-bit ARM Cortex-M4
Number of I/O Up to 30
Frequency Range 2.4 GHz ISM Band
Supply Voltage 1.8V ÿ 3.6V

CYW20822P4EPI040XUMA1 Key Features

  • Integrated Bluetooth 5.2 support enables both BLE and Bluetooth Classic communication, providing versatile wireless connectivity for IoT and industrial devices.
  • Robust operating temperature range from -40??C to +105??C ensures reliable performance in demanding industrial and outdoor environments.
  • Compact QFN-40 surface-mount package streamlines PCB design and allows for high-density component placement in space-constrained applications.
  • ARM Cortex-M4 core architecture delivers efficient processing for complex wireless protocols and custom application code.

CYW20822P4EPI040XUMA1 Advantages vs Typical Alternatives

This Bluetooth SoC stands out with its wide temperature tolerance, advanced Bluetooth 5.2 support, and efficient ARM Cortex-M4 architecture. Compared to typical alternatives, it offers enhanced integration, flexible I/O, and reliable wireless performance, making it an excellent choice for industrial, commercial, and IoT designs requiring both robustness and low power consumption. Its compact package and surface-mount capabilities further simplify assembly and manufacturing.

Typical Applications

  • Industrial wireless sensor networks, where robust Bluetooth connectivity and extended temperature operation ensure dependable real-time data communication in harsh conditions.
  • Smart home and building automation systems leveraging BLE for efficient device-to-device communication and seamless integration with mobile platforms.
  • Medical devices requiring secure, low-power wireless data transfer and compact circuit board designs for portable equipment.
  • Asset tracking and logistics, utilizing the 2.4 GHz ISM band to enable reliable location and status monitoring across diverse environments.

CYW20822P4EPI040XUMA1 Brand Info

This product is part of a reputable line of Bluetooth system-on-chip solutions designed for high reliability and flexibility in wireless applications. The CYW20822P4EPI040XUMA1 targets demanding industrial, commercial, and connected device markets, combining advanced BLE and Bluetooth Classic capabilities in a compact, integrated platform. Its brand is recognized for robust connectivity, ease of integration, and suitability for extended temperature applications.

FAQ

What are the main wireless communication protocols supported by this device?

This device supports both Bluetooth Low Energy (BLE) and Bluetooth Classic, fully compliant with the Bluetooth 5.2 specification. This enables compatibility with a broad ecosystem of wireless devices and applications.

Is the CYW20822P4EPI040XUMA1 suitable for use in harsh industrial environments?

Yes, its wide operating temperature range from -40??C to +105??C and robust design make it well-suited for deployment in industrial and outdoor settings where environmental factors are a concern.

What advantages does the QFN-40 package provide for PCB designers?

The compact QFN-40 package enables high-density layouts, facilitates efficient heat dissipation, and supports surface-mount assembly, making it ideal for modern, space-constrained electronic designs.

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Can this device be used in battery-powered applications?

Yes, its support for low-power Bluetooth operation and efficient ARM Cortex-M4 core make it an excellent choice for battery-powered devices that require extended operational lifetimes without sacrificing wireless performance.

What application sectors benefit most from integrating this Bluetooth SoC?

Sectors such as industrial automation, smart buildings, medical devices, and logistics benefit from its strong wireless performance, integration flexibility, and ability to operate reliably across a wide temperature spectrum.

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