CYW89072BRFB5G Bluetooth Combo IC, Wireless Module, FBGA Package

  • Provides integrated wireless connectivity, enabling devices to exchange data efficiently without physical cables.
  • Supports Bluetooth and Wi-Fi protocols, ensuring compatibility with a wide range of wireless standards for flexible design options.
  • Offered in a compact BGA package, which helps reduce board space requirements for smaller device designs.
  • Ideal for use in smart home devices, facilitating seamless connections between sensors, appliances, and user interfaces.
  • Manufactured to meet industry quality standards, contributing to stable and consistent long-term device performance.
SKU: CYW89072BRFB5G Category: Brand:
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产品上方询盘

CYW89072BRFB5G Overview

The CYW89072BRFB5G is a highly integrated wireless connectivity solution designed for modern industrial and commercial electronics. This advanced module combines robust wireless performance with compact packaging, making it suitable for demanding embedded applications. Its design targets high reliability and seamless integration, helping engineers develop efficient and scalable products. With a focus on flexibility and compatibility, this device is ideal for a wide range of wireless communication systems. For further sourcing or technical details, visit IC Manufacturer.

CYW89072BRFB5G Technical Specifications

Parameter Value
Part Number CYW89072BRFB5G
Mounting Type Surface Mount
Package / Case FBGA-90
Operating Temperature Range -40??C to +85??C
Technology Wireless
RoHS Status RoHS Compliant
ECCN 5A992C
Moisture Sensitivity Level (MSL) 3 (168 Hours)

CYW89072BRFB5G Key Features

  • Integrated wireless technology enables efficient, low-latency communication, reducing external component count and streamlining system design.
  • Wide operating temperature range from -40??C to +85??C ensures reliable performance in both industrial and commercial environments.
  • Surface mount design in an FBGA-90 package supports high-density PCB layouts, making it suitable for compact devices and space-constrained applications.
  • RoHS compliance meets stringent environmental regulations, supporting sustainable product development and global market acceptance.

CYW89072BRFB5G Advantages vs Typical Alternatives

This wireless solution stands out due to its excellent integration and proven reliability across a wide temperature range. The compact FBGA-90 package and surface mount capability offer superior flexibility for dense board layouts. Compliance with RoHS and a robust moisture sensitivity level further enhance long-term durability and simplify global supply chain integration. These factors collectively make it a preferred choice for demanding connectivity applications where performance and reliability are critical.

Typical Applications

  • Industrial wireless communication systems benefit from the device??s robust operating range and surface mount packaging, supporting reliable connectivity in automation and process control environments.
  • Commercial smart appliances use this device for seamless wireless integration, enhancing user experience and enabling IoT functionalities with minimal design overhead.
  • Embedded modules in smart sensors leverage the compact form factor and reliability, allowing for efficient data transmission in resource-constrained designs.
  • Building automation systems incorporate this device to enable wireless control and monitoring, improving operational efficiency and flexibility.

CYW89072BRFB5G Brand Info

The CYW89072BRFB5G is a product that reflects the brand??s commitment to delivering high-performance wireless connectivity solutions for the electronics industry. Engineered to meet the rigorous requirements of industrial, commercial, and embedded system applications, this device offers seamless integration and dependable operation. Its advanced design and compliance standards underline the brand??s focus on innovation, quality, and global accessibility.

FAQ

What is the recommended operating temperature range for CYW89072BRFB5G?

The device is rated for operation from -40??C to +85??C, making it suitable for use in both industrial and commercial environments where temperature extremes are common.

What packaging type does this wireless solution utilize?

This model uses the FBGA-90 package, which is a fine-pitch ball grid array. This enables efficient surface mounting and supports compact PCB design for space-limited applications.

Is the CYW89072BRFB5G compliant with environmental regulations?

Yes, the device is RoHS compliant, ensuring it meets strict environmental standards and can be used in global markets that require hazardous substance controls.

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产品中间询盘

What is the moisture sensitivity level (MSL) of this part?

The moisture sensitivity level is rated at MSL 3 (168 hours), indicating the device??s handling and storage requirements for maintaining long-term reliability during assembly.

In what types of applications is this wireless device commonly used?

It is typically found in industrial automation, commercial smart appliances, embedded sensor systems, and building automation??any area needing reliable, integrated wireless connectivity in a compact form factor.

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