CYW4329EKUBGT Overview
The CYW4329EKUBGT is a highly integrated wireless communication device designed for demanding industrial and embedded applications. It delivers robust wireless connectivity in a compact surface-mount package, supporting advanced integration and design flexibility. With optimized hardware features and a focus on low power operation, this solution is suitable for environments where reliability and performance are critical. Its form factor and technical attributes make it a strong choice for engineers seeking dependable wireless modules. Learn more about sourcing from IC Manufacturer.
CYW4329EKUBGT Technical Specifications
| Attribute | Value |
|---|---|
| Part Number | CYW4329EKUBGT |
| Package / Case | UBGA-90 |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| ECCN (Export Control Classification Number) | 5A992C |
| HTS Code | 8542.31.0001 |
| REACH Status | REACH Unaffected |
CYW4329EKUBGT Key Features
- Compact UBGA-90 package enables high-density PCB layout, saving valuable board space in complex designs.
- Surface mount configuration streamlines automated assembly, reducing manufacturing time and improving production efficiency.
- RoHS compliance ensures suitability for environmentally regulated markets and applications, removing hazardous substances from the product lifecycle.
- Moisture Sensitivity Level 3 rating (168 hours) supports standard reflow processing while maintaining device reliability during assembly.
CYW4329EKUBGT Advantages vs Typical Alternatives
This component stands out among comparable wireless solutions by offering a combination of compact form factor, RoHS compliance, and robust moisture sensitivity performance. Its advanced packaging and mounting features support higher integration and reliability, which are essential for industrial and embedded system designers seeking to optimize both performance and compliance.
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Typical Applications
- Wireless communication modules in industrial automation: The device??s compactness and surface mount form make it ideal for high-density control systems and industrial IoT gateways, improving connectivity and integration in challenging environments.
- Embedded systems requiring reliable wireless connectivity: Its robust MSL and compliance features support dependable operation in embedded platforms where board space and reliability are at a premium.
- Consumer electronics with regulated material requirements: RoHS and REACH status enable use in regions and applications with strict environmental regulations, supporting global product deployment.
- Networked sensor nodes in smart infrastructure: The component is suitable for wireless sensor networks, enabling efficient data transmission in smart building and infrastructure projects.
CYW4329EKUBGT Brand Info
The CYW4329EKUBGT is produced by a leading semiconductor manufacturer known for delivering innovative wireless connectivity solutions for industrial and embedded markets. This device reflects the brand??s commitment to quality, reliability, and regulatory compliance, providing engineers with a trusted choice for advanced wireless system designs. Its application versatility and robust technical standards support a wide range of use cases across multiple industries.
FAQ
What is the package type and why is it important for design?
The CYW4329EKUBGT comes in a UBGA-90 package, which is a highly integrated, compact form factor. This allows for efficient use of PCB space, supporting denser layouts and miniaturization of end products, particularly in embedded and IoT applications.
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Is this device compliant with environmental regulations?
Yes, the device is RoHS compliant and REACH unaffected, making it suitable for use in global markets where environmental standards and hazardous substance restrictions are enforced. This ensures easier regulatory approval and market access.
What mounting method is supported by this part?
It is designed for surface mount technology (SMT), enabling automated assembly and soldering processes. SMT compatibility simplifies manufacturing and supports high-volume production lines with improved efficiency and consistency.
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How does the moisture sensitivity level affect assembly?
This component is rated at Moisture Sensitivity Level 3 (168 hours), indicating that it can withstand standard reflow soldering processes if handled within recommended exposure times. This protects device reliability during manufacturing and assembly operations.
Which applications benefit most from using this device?
Applications that require compact wireless modules, such as industrial automation systems, embedded platforms, consumer electronics, and smart infrastructure sensor nodes, benefit significantly due to its size, compliance, and robust assembly characteristics.
