CYBL11172-56LQXI Overview
The CYBL11172-56LQXI is a highly integrated system-on-chip (SoC) solution designed for advanced embedded wireless applications. With its compact QFN-56 package and robust feature set, this device enables engineers to create efficient, low-power systems for industrial and commercial environments. The part is suitable for demanding applications that require reliable connectivity, flexible I/O, and streamlined integration. Its attributes make it ideal for projects where board space and power consumption are critical, while maintaining ease of design and scalability. Learn more at IC Manufacturer.
CYBL11172-56LQXI Technical Specifications
| Parameter | Value |
|---|---|
| Part Number | CYBL11172-56LQXI |
| Package / Case | QFN-56 |
| Mounting Type | Surface Mount |
| RoHS Status | RoHS Compliant |
| Operating Temperature Range | -40??C to 85??C |
| Supply Voltage | 2.0V to 3.6V |
| Core Processor | ARM Cortex-M0 |
| Interface Type | Programmable, multiple options |
| Integrated Wireless | Yes |
| Pin Count | 56 |
CYBL11172-56LQXI Key Features
- Integrated ARM Cortex-M0 core ensures efficient processing with low power consumption, ideal for battery-powered and energy-sensitive designs.
- Multiple programmable interfaces enable flexible connectivity to a wide range of sensors, actuators, and peripherals, supporting versatile application requirements.
- Compact QFN-56 surface-mount package allows for high-density PCB layouts, reducing overall system size and enabling streamlined manufacturing.
- Wide operating temperature range from -40??C to 85??C guarantees reliable operation in harsh industrial and commercial environments.
CYBL11172-56LQXI Advantages vs Typical Alternatives
Compared to standard microcontrollers and wireless SoC solutions, this device offers a balanced combination of processing performance, energy efficiency, and integration. Its ARM Cortex-M0 core, together with a rich set of programmable interfaces, reduces the need for external components. The result is greater reliability, lower BOM cost, and simplified design for projects demanding robust wireless connectivity and compact form factors.
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Typical Applications
- Industrial wireless sensor nodes: With its integrated wireless capabilities and flexible interfaces, this device is well-suited for remote monitoring and control systems in manufacturing, automation, and process environments where robust connectivity is essential.
- Smart home and building automation: The combination of low power operation and multiple I/O options enables seamless integration in lighting, HVAC, and security control systems.
- Wearable and portable devices: Its compact form factor and energy efficiency make it ideal for health monitoring, fitness tracking, and other battery-operated applications.
- Asset tracking and logistics: Reliable connectivity and extended temperature tolerance support demanding asset management solutions in transportation and warehousing.
CYBL11172-56LQXI Brand Info
The CYBL11172-56LQXI is engineered for professionals who require a robust, integrated solution for embedded wireless systems. Its design reflects a commitment to quality, reliability, and flexibility, making it a preferred choice for industrial and commercial technology developers. The product stands out for its ability to streamline development cycles, reduce space requirements, and deliver consistent performance across a wide range of environmental conditions.
FAQ
What is the core architecture used in the CYBL11172-56LQXI?
This device employs an ARM Cortex-M0 core, which is known for its balance of processing capability and low-power consumption. This architecture is widely adopted for energy-efficient embedded systems, ensuring long battery life and reliable performance.
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Is the CYBL11172-56LQXI suitable for industrial temperature ranges?
Yes, the device supports an operating temperature range from -40??C to 85??C. This makes it suitable for deployment in a variety of industrial and commercial environments where temperature extremes are common.
What mounting type does the package support?
The device is offered in a QFN-56 package, which is optimized for surface mount technology (SMT). This enables automated assembly and high-density PCB layouts, reducing overall manufacturing complexity and cost.
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Does this part support integrated wireless functionality?
Yes, integrated wireless capability is a key feature, enabling seamless connectivity in embedded applications. This integration eliminates the need for separate wireless modules, streamlining design processes and saving board space.
What are the main advantages of using this SoC in embedded systems?
Main advantages include a compact footprint, low power requirements, flexible interface options, and robust performance across a wide temperature range. These attributes help engineers reduce system complexity while maintaining design flexibility and reliability.
