CYW20721B2KUMLG Overview
The CYW20721B2KUMLG is a highly integrated, Bluetooth-enabled semiconductor designed for demanding wireless connectivity in industrial and consumer electronics. Engineered for robust performance, this device is well-suited for embedded systems requiring reliable data transmission and energy efficiency. Its advanced architecture and support for Bluetooth protocols enable seamless integration in a wide range of wireless applications. With a space-efficient package and versatile interface support, the CYW20721B2KUMLG enables developers to design compact, power-conscious solutions that meet modern connectivity standards. For more details, visit IC Manufacturer.
CYW20721B2KUMLG Technical Specifications
| Parameter | Value |
|---|---|
| Device Type | Bluetooth IC |
| Package | 56-UFQFN Exposed Pad |
| Mounting Style | Surface Mount |
| Number of Pins | 56 |
| Operating Temperature Range | -40??C to +85??C |
| Protocol Support | Bluetooth |
| RoHS Compliance | RoHS Compliant |
| Lead Status | Lead Free |
CYW20721B2KUMLG Key Features
- Integrated Bluetooth functionality provides reliable and efficient wireless communication, reducing the need for external modules and simplifying PCB layout.
- Surface-mountable 56-UFQFN package enables high-density board designs and supports compact end products for space-constrained applications.
- Wide operating temperature range from -40??C to +85??C ensures stable operation in industrial and outdoor environments, enhancing long-term reliability.
- RoHS compliance and lead-free status make the device suitable for environmentally conscious applications and help meet global regulatory requirements.
CYW20721B2KUMLG Advantages vs Typical Alternatives
This Bluetooth IC stands out among wireless connectivity solutions thanks to its compact UFQFN package, which streamlines integration in dense assemblies. Its robust operating temperature range offers consistent performance in both industrial and consumer devices. Additionally, full RoHS compliance and lead-free construction help ensure global market access and environmental safety, outperforming many typical alternatives in regulatory readiness and reliability.
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Typical Applications
- Wireless data transmission modules: The device is ideal for embedded wireless modules in industrial and consumer electronics, offering reliable Bluetooth connectivity and streamlined integration into control systems, sensors, and user interfaces.
- IoT gateways and hubs: Its robust feature set supports the development of IoT gateway products, enabling secure, energy-efficient Bluetooth communication for smart home or industrial automation networks.
- Wearable devices: Thanks to its compact form factor and energy-efficient operation, the IC is well-suited for fitness trackers, medical monitoring devices, and other portable electronics where space and power are at a premium.
- Smart appliances and controllers: The CYW20721B2KUMLG can be integrated into home automation devices, remote controls, and connected appliances, facilitating wireless control and monitoring capabilities.
CYW20721B2KUMLG Brand Info
The CYW20721B2KUMLG represents a specialized solution within the Bluetooth semiconductor market, tailored for applications that demand a balance of performance, integration, and regulatory compliance. This device is part of a portfolio that emphasizes reliability and ease of integration, helping engineers accelerate time-to-market for wireless-enabled products. Its combination of a modern package, industrial-grade temperature support, and RoHS compliance positions it as a dependable choice for next-generation connectivity designs.
FAQ
What type of applications are best suited for the CYW20721B2KUMLG?
This device is ideal for embedded wireless modules, IoT gateways, wearable electronics, and smart appliances where reliable Bluetooth connectivity and a compact footprint are essential. Its wide temperature range also makes it suitable for industrial environments.
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What makes the CYW20721B2KUMLG environmentally compliant?
The IC is RoHS compliant and lead-free, which means it meets international standards for hazardous material restrictions. This ensures suitability for markets with strict environmental regulations and supports sustainable product development.
How does the package type benefit board design?
The 56-UFQFN exposed pad package allows for high-density, surface-mount assembly, enabling compact PCB layouts. This is especially beneficial for applications where board space and height are limited.
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Can the CYW20721B2KUMLG operate in harsh temperature environments?
Yes, the IC supports an operating temperature range from -40??C to +85??C, making it well-suited for industrial, automotive, or outdoor applications where devices may be exposed to extreme conditions.
What protocol does the CYW20721B2KUMLG support?
This component is designed to support Bluetooth communication, providing robust wireless data transfer capabilities for a variety of embedded and consumer electronics applications requiring standard Bluetooth protocol support.
