CYW20734UA1KFFB3GT Bluetooth Module, Wireless SoC, FBGA Package

  • Enables wireless communication for devices, allowing seamless data exchange without physical connections.
  • If low energy consumption is specified, it helps extend battery life for portable electronics.
  • Compact package type maximizes board-space savings, supporting miniaturized product designs.
  • Ideal for smart home products, the module simplifies connecting sensors to central control hubs.
  • Manufactured with consistent quality standards, delivering stable operation over extended use in embedded systems.
SKU: CYW20734UA1KFFB3GT Category: Brand:
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产品上方询盘

CYW20734UA1KFFB3GT Overview

The CYW20734UA1KFFB3GT is a highly integrated Bluetooth wireless module designed for seamless short-range communication in industrial, commercial, and consumer applications. With robust connectivity features and compact packaging, it enables efficient wireless data transfer while supporting industry-standard protocols. The device??s integration of core Bluetooth functionalities and ease of system integration make it a preferred choice for engineers seeking reliable performance and streamlined development. For more details, visit IC Manufacturer.

CYW20734UA1KFFB3GT Technical Specifications

Parameter Value
Part Number CYW20734UA1KFFB3GT
Function Bluetooth Wireless Module
Package 32-UFQFN Exposed Pad
Mounting Type Surface Mount
Operating Temperature -40??C to +85??C
Protocol Bluetooth
RoHS Status RoHS Compliant
Lead-Free Status Lead-Free

CYW20734UA1KFFB3GT Key Features

  • Integrated Bluetooth protocol stack, enabling straightforward wireless connectivity for a wide range of applications.
  • Compact 32-UFQFN package design allows for easy integration into space-constrained systems and portable devices.
  • Industrial-grade operating temperature range (-40??C to +85??C) ensures reliable performance in demanding environments.
  • Surface mount technology simplifies the assembly process and supports high-volume manufacturing requirements.
  • RoHS compliant and lead-free, supporting environmentally responsible product designs.

CYW20734UA1KFFB3GT Advantages vs Typical Alternatives

This device delivers a balance of integration, reliability, and environmental compliance that stands out against standard Bluetooth modules. Its wide temperature range and RoHS compliance make it ideal for industrial and commercial deployments, while the compact UFQFN packaging provides design flexibility and helps reduce overall system footprint. These related function words highlight the efficiency and suitability for demanding wireless applications.

Typical Applications

  • Wireless data transmission modules in industrial automation, enabling machine-to-machine communication and remote system monitoring with robust Bluetooth connections.
  • Consumer electronics such as wireless headsets, mice, and keyboards, benefiting from stable Bluetooth connectivity and compact design.
  • Medical devices requiring reliable short-range communication for secure data transfer in clinical and patient environments.
  • Smart home and building automation systems, where the module supports wireless control and sensor integration in energy-efficient installations.

CYW20734UA1KFFB3GT Brand Info

The CYW20734UA1KFFB3GT is part of a recognized product line specializing in Bluetooth wireless solutions. This module is engineered to deliver dependable communication performance while meeting the strict quality and compliance standards demanded by industrial and commercial markets. Its blend of integration, reliability, and environmental responsibility has established it as a trusted choice for engineers and system designers requiring robust Bluetooth functionality in their projects.

FAQ

What type of applications is the CYW20734UA1KFFB3GT best suited for?

This module is ideal for wireless data transmission in industrial automation, consumer electronics, medical devices, and smart home systems, where reliable Bluetooth communication and compact design are required.

Does the CYW20734UA1KFFB3GT support operation in harsh environments?

Yes, the device operates across a wide temperature range from -40??C to +85??C, ensuring stable performance in both industrial and commercial environments with demanding conditions.

What are the main benefits of the 32-UFQFN package?

The 32-UFQFN exposed pad package offers a small footprint, efficient heat dissipation, and suitability for high-density board layouts, making it well-suited for space-constrained products.

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产品中间询盘

Is the CYW20734UA1KFFB3GT compliant with environmental standards?

This module is RoHS compliant and lead-free, supporting the development of environmentally responsible products and helping manufacturers meet global regulatory requirements.

How does the surface mount design support manufacturing?

The surface mount design streamlines automated assembly processes, reduces manufacturing time, and ensures consistent placement accuracy, which is advantageous for large-scale production.

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