CYW20704UA2KFFB1GT Bluetooth Controller Module, QFN Package

  • Enables wireless connectivity, simplifying device integration and communication in various embedded systems.
  • Integrates Bluetooth functionality for seamless short-range data exchange between compatible devices.
  • Compact package design helps reduce board space, making it suitable for space-constrained applications.
  • Ideal for use in smart home controllers, allowing efficient remote monitoring and control capabilities.
  • Manufactured to support consistent performance, helping ensure stable operation over the product??s lifetime.
SKU: CYW20704UA2KFFB1GT Category: Brand:
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产品上方询盘

CYW20704UA2KFFB1GT Overview

The CYW20704UA2KFFB1GT is a highly integrated Bluetooth solution designed for a wide range of industrial and commercial wireless applications. Engineered for robust performance, this device combines efficient communication capabilities with reliable connectivity features, making it ideal for embedded systems requiring compact wireless modules. Its integration of key wireless technologies provides product designers with a cost-effective path to add Bluetooth functionality while maintaining low power consumption and high data fidelity. For engineers seeking a proven industrial Bluetooth IC, this device delivers a practical balance of performance and integration. Learn more at IC Manufacturer.

CYW20704UA2KFFB1GT Technical Specifications

Parameter Specification
Device Type Bluetooth Integrated Circuit
Package 64-VFBGA
Mounting Type Surface Mount
Operating Temperature Range -40??C to +85??C
RoHS Status RoHS Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Lead Finish Nickel/Palladium/Gold
Core Architecture Bluetooth Controller
Supply Voltage Supported (see datasheet for details)

CYW20704UA2KFFB1GT Key Features

  • Integrated Bluetooth controller enables seamless wireless communication, reducing the need for external components and simplifying design.
  • Surface-mount VFBGA package allows for space-efficient PCB layouts, which is important for compact industrial designs.
  • Wide operating temperature range (-40??C to +85??C) ensures reliable performance in harsh industrial or commercial environments.
  • RoHS compliance and standard moisture sensitivity level support sustainable, high-quality manufacturing and supply chain processes.
  • Industrial-grade reliability and proven Bluetooth functionality make this IC suitable for demanding wireless applications.

CYW20704UA2KFFB1GT Advantages vs Typical Alternatives

Compared to typical alternatives, this Bluetooth IC stands out with its high integration, robust industrial temperature support, and compact BGA packaging. These advantages provide reliable wireless connectivity, efficient space utilization, and simplified system design. Its compliance with global standards and MSL 3 rating further enhance manufacturability and long-term product reliability, making it a preferred choice for demanding embedded applications.

Typical Applications

  • Industrial wireless communication modules: The device??s robust Bluetooth capabilities make it ideal for integrating into industrial control systems, enabling reliable wireless data exchange in factory automation and process monitoring.
  • Consumer and commercial electronics: Its integration and compact footprint support use in smart home devices, audio systems, and connected appliances where wireless connectivity is required.
  • Medical devices: The wide operating temperature range and compliance features allow deployment in medical monitoring equipment and healthcare instrumentation, ensuring performance and safety.
  • Asset tracking and logistics: Enables efficient Bluetooth-based tracking solutions, providing real-time data transmission for inventory management and supply chain applications.

CYW20704UA2KFFB1GT Brand Info

The CYW20704UA2KFFB1GT is manufactured by a leading provider of wireless semiconductor solutions, known for delivering reliable and innovative Bluetooth ICs to the market. This product is specifically engineered to address industrial and commercial wireless application requirements, offering dependable performance with advanced integration in a surface-mount BGA package. The brand??s emphasis on quality, compliance, and broad compatibility ensures this IC supports a wide range of products, making it a trusted choice for engineers and designers building the next generation of connected systems.

FAQ

What packaging format is available for this Bluetooth IC?

The device comes in a 64-VFBGA (Very Fine Ball Grid Array) package, which is well-suited for high-density surface-mount assembly. This packaging enables compact PCB layouts and robust electrical connections, meeting the needs of modern embedded designs.

Is the CYW20704UA2KFFB1GT compliant with RoHS directives?

Yes, it is RoHS compliant, ensuring that the device meets global environmental and safety standards for lead-free manufacturing. This supports customers in developing eco-friendly products and maintaining regulatory compliance.

Can this IC operate in extreme temperature environments?

The device is rated for an operating temperature range from -40??C to +85??C. This wide range makes it suitable for industrial, commercial, and some medical environments where reliable wireless connectivity is required under varying temperature conditions.

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What is the moisture sensitivity level (MSL) of this device?

The product has a Moisture Sensitivity Level of 3, which means it can be exposed to ambient room conditions for up to 168 hours before reflow soldering without risk of moisture-induced damage, facilitating standard assembly processes.

What are some common use cases for this Bluetooth IC?

Typical use cases include industrial wireless communication, consumer electronics with Bluetooth features, medical device integration, and asset tracking systems. Its combination of compact footprint, industrial temperature rating, and reliable performance make it versatile across these application areas.

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