CYW20736A1KML2GT Overview
The CYW20736A1KML2GT is a Bluetooth Smart (Bluetooth Low Energy) wireless microcontroller designed for integration in demanding, space-sensitive IoT and industrial applications. Its combination of a low-power ARM Cortex-M3 core and advanced Bluetooth transceiver enables reliable, energy-efficient wireless connectivity. This solution is ideal for engineers seeking compact, highly integrated wireless functionality, supporting fast development cycles and robust performance. With its optimized power management and compact QFN package, the device is well-suited for next-generation industrial modules and smart devices. For more technical details, visit IC Manufacturer.
CYW20736A1KML2GT Technical Specifications
| Parameter | Details |
|---|---|
| Core Architecture | ARM Cortex-M3 |
| Wireless Protocol | Bluetooth Smart (Bluetooth Low Energy 4.1 compliant) |
| Operating Voltage | 1.8V to 3.6V |
| Package Type | QFN-40 (Quad Flat No-lead) |
| GPIOs | Up to 25 programmable GPIOs |
| Flash Memory | 128 KB (embedded Flash) |
| SRAM | 60 KB |
| Temperature Range | -40??C to +85??C (industrial grade) |
| Frequency | 2.4 GHz ISM Band |
CYW20736A1KML2GT Key Features
- Integrated ARM Cortex-M3 core delivers efficient processing, enabling rapid execution of wireless protocols and application code for low-latency performance.
- Bluetooth Low Energy 4.1 compliance ensures seamless connectivity and compatibility with a wide range of IoT devices and industrial gateways.
- Optimized for low power operation, extending battery life in portable and remote sensor applications by leveraging advanced power management techniques.
- Compact QFN-40 package with up to 25 programmable GPIOs supports flexible hardware interfacing and minimizes board space requirements for dense designs.
- Industrial temperature range from -40??C to +85??C enhances deployment versatility in harsh environments.
- On-chip Flash and SRAM support code and data storage without external memory, reducing BOM cost and improving reliability.
CYW20736A1KML2GT Advantages vs Typical Alternatives
This device stands out with its highly integrated Bluetooth Low Energy 4.1 radio and embedded ARM Cortex-M3, offering reduced component count and streamlined PCB layouts compared to discrete solutions. Its low power consumption and industrial temperature rating make it a preferred choice for battery-powered and rugged applications. The combination of embedded Flash, extensive GPIOs, and compact package supports versatile design requirements, enhancing overall design efficiency and reliability.
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Typical Applications
- Wireless sensor nodes and asset tracking: Enables compact, battery-powered sensors for industrial monitoring, environmental sensing, and inventory tracking with robust Bluetooth connectivity and extended operational life.
- Smart home and building automation: Integrates seamlessly into lighting controls, access systems, and HVAC monitoring due to its small footprint and low energy operation.
- Wearable health and fitness devices: Supports miniaturized designs with reliable Bluetooth communication, long battery life, and flexible GPIOs for user interfaces and sensors.
- Remote controls and human-machine interfaces: Facilitates low-power, compact remote devices for consumer electronics, industrial equipment, and smart appliances.
CYW20736A1KML2GT Brand Info
This Bluetooth Smart wireless microcontroller is part of a broader family of industrial-grade wireless solutions designed to accelerate IoT innovation. Its manufacturer is known for delivering dependable, energy-efficient connectivity silicon for the global electronics market. This device embodies the brand??s commitment to integration, performance, and flexibility, making it a trusted component in high-volume, mission-critical wireless modules and embedded platforms.
FAQ
What is the main advantage of using the CYW20736A1KML2GT in industrial IoT applications?
The key advantage lies in its integration of Bluetooth Low Energy 4.1 and ARM Cortex-M3 core, which streamlines wireless connectivity and application processing on a single chip. This reduces design complexity, minimizes PCB area, and enhances overall system reliability??critical for industrial deployments where space and power budgets are limited.
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What packaging format is available, and how does it benefit hardware designers?
The device is supplied in a compact QFN-40 package, which offers a balance between high pin count and minimal footprint. This helps designers optimize board layouts for both space efficiency and robust signal routing, making it ideal for densely populated or portable designs.
Is the CYW20736A1KML2GT suitable for use in harsh temperature environments?
Yes, it supports an industrial temperature range from -40??C to +85??C, making it suitable for deployment in harsh, demanding environments such as industrial automation, outdoor sensing, and ruggedized equipment.
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How does the integrated memory benefit end applications?
The embedded Flash (128 KB) and SRAM (60 KB) allow developers to store application firmware and operational data without needing external memory components. This reduces bill of materials cost, simplifies hardware design, and improves overall system robustness.
What types of wireless connectivity does this device provide?
The microcontroller supports Bluetooth Smart (Bluetooth Low Energy) 4.1 protocol, offering reliable, energy-efficient wireless links for a broad range of IoT, automation, and consumer device applications. This ensures interoperability with BLE-enabled devices and simplifies integration into wireless networks.
