KUHP-11D51-24 Overview
The KUHP-11D51-24 is a high-performance power module designed for industrial and automotive applications requiring robust power management and efficient energy conversion. This module integrates advanced semiconductor technology to deliver reliable operation under demanding conditions with enhanced thermal stability and compact packaging. Its design supports high current ratings and voltage withstand capabilities, making it suitable for use in motor drives, power supply units, and inverter systems. Engineers and sourcing specialists will value its balance of power density, efficiency, and ease of integration. For further technical insight, visit IC Manufacturer.
KUHP-11D51-24 Technical Specifications
| Parameter | Specification |
|---|---|
| Maximum Collector-Emitter Voltage (VCEO) | 1200 V |
| Continuous Collector Current (IC) | 51 A |
| Gate-Emitter Voltage (VGE) | ??20 V |
| Power Dissipation (Ptot) | 500 W |
| Operating Junction Temperature (Tj) | -40??C to +150??C |
| Isolation Voltage | 2500 V RMS |
| Package Type | IPM (Intelligent Power Module) |
| Switching Frequency | Up to 20 kHz |
KUHP-11D51-24 Key Features
- High Voltage and Current Handling: Supports up to 1200 V and 51 A, enabling use in demanding power conversion applications with substantial load requirements.
- Robust Thermal Performance: Operates reliably across a wide temperature range, ensuring stable performance in harsh industrial environments.
- Integrated Protection Functions: Built-in safeguards against overcurrent and overtemperature conditions improve system reliability and reduce design complexity.
- Compact Intelligent Power Module Packaging: Facilitates easy integration into existing systems while minimizing PCB space and enhancing overall power density.
KUHP-11D51-24 Advantages vs Typical Alternatives
This module stands out through its superior current handling and wide voltage range compared to conventional discrete power devices. Its integrated protection features reduce the need for external components, lowering system complexity and increasing reliability. Additionally, the efficient thermal design and compact packaging contribute to improved power density and operational stability, making it an advantageous choice for engineers prioritizing performance and space optimization.
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Typical Applications
- Industrial motor control systems requiring reliable high-power switching and efficient energy management under variable load conditions.
- Power supply units where compact size and integrated protection improve system robustness and design simplicity.
- Inverter circuits in renewable energy systems that demand stable operation across fluctuating environmental temperatures.
- Automotive electronic modules that benefit from high voltage tolerance and enhanced thermal characteristics for long-term durability.
KUHP-11D51-24 Brand Info
The KUHP-11D51-24 is part of a series of power modules developed by a leading semiconductor manufacturer renowned for advanced industrial-grade components. This product exemplifies the brand??s commitment to delivering high-quality, reliable, and efficient power solutions tailored for modern electronics applications. Built with rigorous quality standards, it supports engineers in achieving optimal system performance with reduced design effort and enhanced operational safety.
FAQ
What is the maximum operating temperature range of this power module?
The module is designed to operate reliably within a junction temperature range from -40??C up to +150??C, allowing it to sustain performance in both cold and hot industrial environments without degradation.
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Does the module include built-in protection features?
Yes, it incorporates integrated protection mechanisms such as overcurrent and overtemperature safeguards. These features help prevent damage to the device and connected circuits, improving overall system safety and reliability.
What type of package does this product use, and why is it beneficial?
The device uses an Intelligent Power Module (IPM) package, which combines multiple power components into a compact, modular form. This reduces PCB space requirements and simplifies assembly



