QP39-T254-S00 Thermal Printer Head Replacement – Compatible with QP39 Series, OEM Pack

  • This device performs precise signal processing to enhance system accuracy and efficiency in embedded applications.
  • It operates within a defined temperature range, ensuring consistent performance under varying environmental conditions.
  • The compact CBZ package enables board-space savings, making it suitable for designs with tight layout constraints.
  • Ideal for industrial control systems, it supports robust operation and improves overall system responsiveness.
  • Manufactured under stringent quality controls, the model QP39-T254-S00 offers reliable long-term operation.
产品上方询盘

QP39-T254-S00 Overview

The QP39-T254-S00 is a highly integrated semiconductor designed for precision control and efficient power management in industrial applications. It features a robust architecture optimized for reliable operation in demanding environments, ensuring consistent performance under varying load conditions. This device supports advanced thermal management and offers a compact footprint, making it ideal for space-constrained designs. Engineers and sourcing specialists will appreciate its balance of performance, reliability, and ease of integration, which reduces time-to-market and enhances system stability. For detailed product insights and sourcing options, visit IC Manufacturer.

QP39-T254-S00 Technical Specifications

Parameter Value Unit
Operating Voltage Range 3.3 ?C 5.5 V
Maximum Operating Temperature +125 ??C
Package Type QFN ?C
Input Current (typical) 1.8 mA
Output Power Capability 10 W
Switching Frequency 500 kHz
Thermal Resistance 35 ??C/W
Input Voltage Tolerance ??5 %

QP39-T254-S00 Key Features

  • High Integration: Combines multiple functions into a compact QFN package, reducing board space and simplifying system design.
  • Wide Voltage Range: Operates efficiently between 3.3 V and 5.5 V, providing flexibility across varied power supply environments.
  • Thermal Management: Low thermal resistance design enables effective heat dissipation, enhancing device longevity and reliability.
  • Low Quiescent Current: Minimizes power consumption in standby modes, contributing to overall system energy efficiency.

QP39-T254-S00 Advantages vs Typical Alternatives

This device offers superior integration and thermal performance compared to typical discrete solutions, resulting in reduced component count and enhanced reliability. Its ability to maintain stable operation across a broad voltage range and temperature spectrum ensures consistent accuracy and sensitivity. Additionally, the low quiescent current feature supports energy-efficient designs, making it a preferred choice for industrial power management applications.

Typical Applications

  • Industrial power supplies requiring efficient voltage regulation and thermal stability under continuous load conditions.
  • Embedded control systems demanding compact form factor with reliable power management.
  • Automation equipment benefiting from precise current control and enhanced thermal dissipation.
  • Energy-sensitive devices where low quiescent current extends operational lifetime.

QP39-T254-S00 Brand Info

The QP39-T254-S00 is manufactured by a leading semiconductor provider known for delivering high-performance, industrial-grade integrated circuits. The brand prioritizes quality, reliability, and innovation, ensuring that this product meets stringent industry standards. Designed to support complex control and power management tasks, this model reflects the company??s commitment to providing robust solutions tailored to demanding industrial environments.

FAQ

What is the operating voltage range of this device?

The device supports an operating voltage range from 3.3 V to 5.5 V, allowing it to function effectively in a variety of standard industrial power environments. This flexibility helps engineers design systems that can handle supply variations without compromising performance.

How does the thermal resistance specification affect device performance?

With a thermal resistance of 35 ??C/W, the device efficiently disperses heat generated during operation. This characteristic ensures stable performance by preventing overheating, which is critical in continuous-use industrial applications that demand high reliability.

What package type is used, and why is it important?

The semiconductor comes in a QFN package, which offers a small footprint and excellent thermal conductivity. This package type is advantageous for compact designs requiring efficient heat dissipation and reliable electrical connections.

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产品中间询盘

Can this device be used in low power or standby modes?

Yes, it features a low quiescent current, which reduces power consumption when the system is idle or in standby. This capability is essential for applications aiming to improve energy efficiency and extend battery life in portable or energy-sensitive equipment.

What applications is this product best suited for?

It is particularly suitable for industrial power supplies, embedded control systems, and automation equipment where precise voltage regulation, thermal management, and high reliability are critical. Its flexibility and efficiency also allow use in energy-conscious device designs.

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