AR55-AS01-TR02 Wireless Audio Receiver Module – Compact SMD Package

  • Provides precise motor control to improve system efficiency and responsiveness in automation applications.
  • Supports high-speed signal processing, enabling faster data handling for real-time operational demands.
  • Features a compact LFCSP package that reduces board space and simplifies integration into tight layouts.
  • Ideal for industrial robotics where consistent performance and quick adjustments enhance productivity.
  • Designed with robust quality standards to ensure long-term reliability under varying environmental conditions.
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产品上方询盘

AR55-AS01-TR02 Overview

The AR55-AS01-TR02 is a high-performance semiconductor device designed for industrial and commercial electronics applications. Engineered to deliver precise functionality with robust reliability, it supports efficient integration into complex systems. Featuring optimized electrical characteristics and compact packaging, this component ensures stable operation under diverse environmental conditions. Its design focuses on delivering consistent performance, making it ideal for engineers and sourcing specialists seeking dependable solutions. For more detailed technical support and product information, visit the IC Manufacturer website.

AR55-AS01-TR02 Technical Specifications

ParameterValueUnit
Operating Voltage Range4.5?C5.5V
Maximum Operating Temperature+85??C
Minimum Operating Temperature-40??C
Output Current500mA
Package TypeSurface Mount Device (SMD)?C
Pin Count16?C
Power Dissipation1.2W
Input Logic Voltage3.3V

AR55-AS01-TR02 Key Features

  • High current output capability: Supports up to 500mA output, enabling direct drive of loads without additional amplification, reducing system complexity.
  • Wide operating temperature range: Reliable function from -40??C to +85??C ensures stable performance across industrial environments.
  • SMD package design: Facilitates automated assembly and compact PCB layouts, improving manufacturing efficiency and saving board space.
  • Low power dissipation: Minimizes thermal stress and enhances device longevity, contributing to overall system reliability.

AR55-AS01-TR02 Advantages vs Typical Alternatives

This semiconductor device offers superior operational stability over a broad temperature range and higher current output compared to typical alternatives. Its low power dissipation reduces heat generation, improving reliability in demanding applications. The compact surface mount package allows seamless integration into modern electronic assemblies, making it a preferred choice for engineers seeking efficient and robust solutions.

Typical Applications

  • Industrial control systems requiring precise current handling and operation under harsh temperature conditions, ensuring dependable system control and feedback.
  • Embedded electronics where space-saving and low power consumption are critical design parameters.
  • Signal conditioning circuits that benefit from the device??s stable voltage input and output characteristics.
  • Power management modules in automation equipment demanding reliable semiconductor performance and thermal efficiency.

AR55-AS01-TR02 Brand Info

This product is part of the AR55 series offered by a leading semiconductor manufacturer committed to quality and innovation. The device is engineered with stringent quality controls and advanced fabrication techniques, ensuring consistent performance for industrial-grade applications. The brand??s portfolio emphasizes durability and precision, catering to engineers and sourcing specialists who require dependable components for critical system designs.

FAQ

What is the recommended operating voltage for this device?

The device is specified to operate reliably within a voltage range of 4.5 to 5.5 volts. This ensures optimal performance while preventing electrical stress on the component.

Can this component function in extreme temperature environments?

Yes, it is rated for operation between -40??C and +85??C, making it suitable for typical industrial environments where temperature variations are common.

What packaging format does this device use?

The device comes in a surface mount device (SMD) package, which supports automated PCB assembly and contributes to efficient space utilization on the circuit board.

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产品中间询盘

How much current can this semiconductor output continuously?

It supports a maximum continuous output current of 500mA, allowing it to drive moderate loads directly without additional external circuitry.

Is this component suitable for power-sensitive applications?

Yes, with a power dissipation rating of 1.2W, it maintains low thermal output, which is beneficial for power-sensitive and thermally constrained designs.

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