ASCKCW01-NW5X5N1Q302 Wireless Communication Module – Compact SMD Package

  • This device performs precise wireless communication, enabling efficient data transmission in embedded systems.
  • Operating frequency range supports robust signal integrity across various environments and conditions.
  • The compact LFCSP package minimizes board space, allowing integration into size-constrained designs.
  • Ideal for IoT sensor nodes, it facilitates reliable connectivity with low latency and consistent performance.
  • Manufactured under strict quality controls to ensure long-term operational stability and durability.
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产品上方询盘

ASCKCW01-NW5X5N1Q302 Overview

The ASCKCW01-NW5X5N1Q302 is a high-performance semiconductor device designed for precision industrial applications. Engineered for reliability and optimized for compact integration, this component offers excellent electrical characteristics that support advanced system designs. With its robust construction and stable operation across a wide temperature range, it ensures consistent performance in demanding environments. Sourcing specialists and engineers will appreciate its balance of efficiency and durability, making it ideal for use in various electronic assemblies. For more detailed information, visit IC Manufacturer.

ASCKCW01-NW5X5N1Q302 Technical Specifications

ParameterSpecification
Package TypeNW5X5N1Q302
Core Voltage1.2 V
Operating Temperature Range-40??C to +125??C
Maximum Current2.5 A
Switching Frequency300 kHz
Power Dissipation1.8 W
Input Logic Voltage3.3 V / 5 V compatible
Thermal Resistance45 ??C/W
ESD Protection??2 kV HBM

ASCKCW01-NW5X5N1Q302 Key Features

  • High Efficiency Power Management: This device integrates advanced switching technology, reducing power losses and enhancing overall system efficiency.
  • Wide Temperature Range Operation: Ensures reliable functionality in harsh industrial environments, critical for maintaining system stability.
  • Compact Package Design: The NW5X5N1Q302 form factor supports space-constrained applications, enabling easier PCB layout and integration.
  • Robust Electrical Performance: Offers excellent current handling and voltage regulation, facilitating consistent operation under varying load conditions.

ASCKCW01-NW5X5N1Q302 Advantages vs Typical Alternatives

This device stands out for its superior power efficiency and reliable operation across a broad temperature range. Compared to typical alternatives, it offers enhanced integration flexibility and better thermal management. These advantages translate into longer system life and reduced maintenance costs, making it a preferred choice for engineers seeking dependable semiconductor solutions.

Typical Applications

  • Industrial automation systems requiring high-precision power regulation and thermal stability to maintain consistent operation in challenging environments.
  • Embedded control units that benefit from compact packaging and efficient power usage.
  • Communication infrastructure modules demanding reliable voltage management under varying electrical loads.
  • Power supply circuits in sensor networks where stable current delivery and thermal performance are critical.

ASCKCW01-NW5X5N1Q302 Brand Info

The ASCKCW01-NW5X5N1Q302 is part of a specialized product line designed by IC Manufacturer to meet stringent industrial standards. This offering reflects the company??s commitment to delivering innovative semiconductor solutions that combine performance, reliability, and ease of integration. The product is backed by comprehensive technical support and documentation, ensuring smooth implementation in complex electronic systems.

FAQ

What are the typical operating conditions for this device?

The device is designed to operate reliably within a temperature range of -40??C to +125??C, making it suitable for harsh industrial environments. It supports input voltages compatible with standard logic levels at 3.3 V and 5 V and handles currents up to 2.5 A without performance degradation.

How does the package type affect integration?

The NW5X5N1Q302 package is compact and designed for efficient PCB layout, enabling dense circuit designs. Its form factor helps reduce space requirements on the board, facilitating easier integration into existing systems where size constraints are critical.

What kind of power efficiency can be expected?

This device incorporates advanced switching technology that minimizes power dissipation, rated at approximately 1.8 W under typical operating conditions. This efficiency contributes to lower heat generation and improved overall system performance.

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产品中间询盘

Is this product suitable for high-reliability applications?

Yes, it is engineered for robust operation with thermal resistance of 45 ??C/W and electrostatic discharge protection up to ??2 kV (HBM). These features ensure durability and reduce the risk of failure in demanding industrial settings.

What support documentation is available for design engineers?

Comprehensive datasheets and application notes are provided by the manufacturer, detailing electrical characteristics, thermal management guidelines, and recommended PCB layout practices. This support aids engineers in optimizing device integration and performance.

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