BCM89335LCUBG Overview
The BCM89335LCUBG is a high-performance, integrated semiconductor device designed for advanced networking and communication applications. It supports a wide range of data rates and offers robust connectivity features, making it ideal for industrial and enterprise environments. Engineered for efficient power management and reliable operation, this device enhances system performance while minimizing energy consumption. Its compact design simplifies integration into complex hardware platforms. Sourced from a leading IC Manufacturer, the BCM89335LCUBG delivers precise functionality tailored for demanding applications requiring consistent throughput and low latency.
BCM89335LCUBG Technical Specifications
| Parameter | Specification |
|---|---|
| Data Rate Support | Up to 1 Gbps |
| Interface Type | PCI Express Gen 2.0 |
| Operating Voltage | 3.3 V |
| Package Type | QFN, 64-pin |
| Frequency Range | Up to 125 MHz |
| Operating Temperature | -40??C to +85??C |
| Power Consumption | Typical 1.5 W |
| Supported Protocols | Ethernet IEEE 802.3 |
BCM89335LCUBG Key Features
- High-speed data transfer: Enables data throughput up to 1 Gbps, ensuring fast and efficient network performance for demanding industrial applications.
- PCI Express Gen 2.0 Interface: Provides a versatile and widely compatible connection method, supporting seamless integration with modern computing systems.
- Low power consumption: Designed for energy efficiency, the device operates typically at 1.5 watts, reducing thermal load and extending system longevity.
- Wide operating temperature range: Supports reliable functionality from -40??C to +85??C, suitable for harsh environmental conditions common in industrial settings.
BCM89335LCUBG Advantages vs Typical Alternatives
This device offers superior integration and energy efficiency compared to typical alternatives, delivering consistent 1 Gbps throughput with lower power consumption. The wide temperature tolerance enhances reliability in industrial environments, while the PCI Express Gen 2.0 interface ensures compatibility and ease of adoption. These factors combine to provide a robust solution optimized for performance and durability.
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Typical Applications
- Industrial Ethernet switches and routers requiring stable 1 Gbps connectivity and robust thermal performance in demanding environments.
- High-speed data communication modules in enterprise networking infrastructure.
- Embedded systems needing reliable, low-power network interface solutions.
- Automation and control systems where precise timing and consistent data throughput are critical.
BCM89335LCUBG Brand Info
Produced by a recognized leader in semiconductor technologies, this product reflects the commitment to innovation and quality synonymous with its brand. The BCM89335LCUBG is part of a family of networking solutions designed to meet rigorous industrial and commercial communication requirements. It embodies advanced design principles and manufacturing standards that ensure long-term reliability and performance consistency.
FAQ
What interface does BCM89335LCUBG support for communication?
The device supports PCI Express Gen 2.0, providing a high-speed and widely compatible interface for seamless integration with a variety of computing and networking platforms.
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What is the typical power consumption of this device?
The BCM89335LCUBG typically consumes about 1.5 watts during operation, enabling efficient power management and reducing heat generation within system designs.
Can this device operate in extreme temperature conditions?
Yes, it is designed to operate reliably within a temperature range from -40??C to +85??C, making it suitable for harsh industrial and outdoor environments.
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What data rates are supported by this semiconductor component?
It supports data transfer rates up to 1 Gbps, making it well-suited for high-speed networking applications requiring consistent bandwidth.
What package type is the BCM89335LCUBG available in?
The device is offered in a 64-pin QFN package, which facilitates compact designs and efficient thermal dissipation in system-level implementations.
