BCM43694B1IRFBG Overview
The BCM43694B1IRFBG is a high-performance wireless communication IC designed for advanced connectivity solutions. It integrates multiple frequency bands and supports high data throughput, making it ideal for industrial and consumer applications requiring robust wireless networking. This device delivers reliable operation with efficient power consumption, enabling seamless integration into demanding environments. Engineered with advanced semiconductor technology, it ensures enhanced signal integrity and system stability. For sourcing engineers and system designers seeking a versatile wireless module, the BCM43694B1IRFBG offers a compelling balance of performance and integration. For detailed specifications and procurement, visit IC Manufacturer.
BCM43694B1IRFBG Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Frequency | 2.4 GHz and 5 GHz dual-band support |
| Data Rate | Up to 1.73 Gbps |
| Transmit Power | Maximum 20 dBm |
| Package Type | QFN, RoHS Compliant |
| Supply Voltage | 3.3 V typical |
| Interface Support | SPI, SDIO, UART |
| Operating Temperature Range | -40 ??C to +85 ??C |
| Integration | On-chip PA, LNA, and RF filters |
BCM43694B1IRFBG Key Features
- Dual-band operation: Enables simultaneous 2.4 GHz and 5 GHz connectivity for flexible wireless networking options.
- High data throughput: Supports data rates up to 1.73 Gbps, ensuring fast and efficient communication in high-demand applications.
- Integrated RF components: On-chip power amplifier, low noise amplifier, and filters reduce system complexity and improve signal integrity.
- Low power consumption: Optimized for energy efficiency, extending device operational life in battery-powered systems.
- Robust interface support: Multiple communication interfaces like SPI, SDIO, and UART provide design flexibility for various host processors.
- Wide operating temperature: Suitable for industrial environments with a thermal range from -40 ??C to +85 ??C.
- Compact package: The QFN form factor facilitates integration into space-constrained applications while maintaining thermal performance.
BCM43694B1IRFBG Advantages vs Typical Alternatives
This device offers superior integration of RF components compared to typical discrete solutions, reducing board space and simplifying design. Its dual-band capability enhances network flexibility, while the high data rate supports demanding throughput requirements. Energy-efficient operation ensures lower power consumption, critical in portable or embedded systems. Reliability across a broad temperature range further distinguishes it from standard alternatives, making it a dependable choice for industrial and commercial wireless implementations.
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Typical Applications
- Wireless routers and access points requiring high-speed dual-band connectivity and reliable signal performance in complex network environments.
- Industrial IoT devices where robust wireless communication and extended temperature operation are essential for remote monitoring and control.
- Consumer electronics such as smart home hubs and media streaming devices benefiting from integrated RF components and efficient data handling.
- Embedded systems and network adapters that demand compact form factor and versatile interface support for flexible integration.
BCM43694B1IRFBG Brand Info
The BCM43694B1IRFBG is developed by a leading semiconductor manufacturer specializing in advanced wireless communication solutions. This product reflects their commitment to delivering high-quality integrated circuits that meet the stringent requirements of modern networking applications. Engineered with precision and reliability, the device supports various industrial and consumer markets, providing scalable connectivity options backed by robust technical support and global distribution channels.
FAQ
What frequency bands does this wireless IC support?
The device supports dual-band operation, covering both 2.4 GHz and 5 GHz frequency bands. This allows for flexible wireless networking by enabling devices to switch between bands for optimal performance and reduced interference.
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What interfaces are available for communication with host processors?
It offers multiple interfaces including SPI, SDIO, and UART. These options provide design flexibility to connect with a wide range of host processors and microcontrollers, facilitating easy integration into various system architectures.
Is the device suitable for industrial temperature environments?
Yes, it operates reliably within a temperature range of -40 ??C to +85 ??C. This makes it suitable for industrial and outdoor applications where ambient conditions can be challenging.
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How does the integration of RF components benefit system design?
By incorporating the power amplifier, low noise amplifier, and RF filters on-chip, the device reduces the need for external components. This simplifies the PCB layout, lowers overall system cost, and improves signal integrity by minimizing losses and interference.
What is the maximum data throughput supported?
The device supports data rates up to 1.73 Gbps, enabling high-speed wireless communication that meets the demands of bandwidth-intensive applications such as streaming, gaming, and large data transfers.
