BCM4366EKMMLW1G Overview
The BCM4366EKMMLW1G is a highly integrated wireless communication module designed to deliver advanced Wi-Fi 6E connectivity with enhanced performance and efficiency. Featuring multi-band support and optimized RF front-end design, it enables seamless integration into next-generation industrial and consumer electronics. This module supports high throughput and low latency, making it ideal for demanding applications requiring robust wireless links. Its compact form factor and efficient power management simplify system design while maintaining reliability. For detailed technical insights and sourcing, visit IC Manufacturer.
BCM4366EKMMLW1G Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standard | Wi-Fi 6E (802.11ax) |
| Frequency Bands | 2.4 GHz, 5 GHz, 6 GHz |
| Number of Spatial Streams | Up to 4×4 MIMO |
| Modulation | 1024-QAM |
| Maximum Data Rate | Up to 3.6 Gbps |
| Interface | SDIO 3.0 / USB 3.0 |
| Operating Voltage | 3.3 V |
| Package Type | Compact LGA module |
| Temperature Range | -40??C to +85??C |
BCM4366EKMMLW1G Key Features
- Multi-band support: Operates across 2.4 GHz, 5 GHz, and 6 GHz bands, enabling greater spectrum availability and reduced interference for reliable wireless communication.
- 4×4 MIMO technology: Supports multiple spatial streams, greatly enhancing throughput and network efficiency in dense environments.
- Advanced modulation: Utilizes 1024-QAM to maximize data rates, ensuring faster and more stable connections for bandwidth-intensive applications.
- Compact form factor: The integrated LGA module design reduces PCB space requirements and simplifies integration into compact devices.
- Low power consumption: Optimized power management reduces energy use without compromising performance, extending device battery life.
- Robust temperature tolerance: Operates reliably in industrial temperature ranges, suitable for harsh environmental conditions.
- Flexible interface options: Supports both SDIO and USB interfaces for versatile connectivity to host processors.
BCM4366EKMMLW1G Advantages vs Typical Alternatives
This module offers superior multi-band Wi-Fi 6E support with 4×4 MIMO and 1024-QAM, delivering higher throughput and lower latency than many standard Wi-Fi modules. Its compact package and integrated power management enhance system design efficiency and reliability, making it more suitable for industrial and high-performance consumer applications where sensitivity and robustness are critical.
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Typical Applications
- High-performance wireless routers and access points requiring tri-band Wi-Fi 6E connectivity for enhanced network capacity and coverage in enterprise and home environments.
- Industrial IoT devices needing reliable, low-latency wireless communication in challenging conditions with extended temperature ranges.
- Next-generation smart home devices requiring efficient, high-speed Wi-Fi integration for seamless multimedia streaming and device control.
- Embedded systems and edge computing platforms demanding compact wireless modules with flexible interface compatibility and robust performance.
BCM4366EKMMLW1G Brand Info
The BCM4366EKMMLW1G module is part of a family of advanced wireless communication solutions from a leading semiconductor provider renowned for innovation in connectivity technologies. This product integrates the latest Wi-Fi 6E standards, emphasizing high throughput, energy efficiency, and multi-band operation. Designed for seamless system integration, it supports a wide array of applications across industrial, consumer, and embedded markets. The brand??s commitment to quality and performance ensures robust wireless connectivity backed by comprehensive technical support and documentation.
FAQ
What frequency bands does this wireless module support?
This device supports operation across three frequency bands: 2.4 GHz, 5 GHz, and the newly allocated 6 GHz band. This multi-band capability allows for greater spectrum availability, reduced interference, and improved network performance in various environments.
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Which interfaces are available for host connectivity?
The module offers flexible host interfaces including SDIO 3.0 and USB 3.0. These options facilitate easy integration with a wide range of processors and systems, providing high-speed data transfer and compatibility with diverse platforms.
What are the temperature operating conditions for this module?
It is designed to operate reliably within an industrial temperature range of -40??C to +85??C. This wide range ensures stable performance even in harsh or variable environmental conditions common in industrial applications.
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How does the module improve wireless throughput and efficiency?
By supporting 4×4 MIMO technology and 1024-QAM modulation, the module significantly increases data throughput and spectral efficiency. These features enable faster data rates and improved signal quality, especially in dense network scenarios.
Is the module suitable for compact device designs?
Yes, the module??s compact LGA package minimizes PCB footprint and simplifies integration into space-constrained designs. This makes it ideal for embedded systems, smart devices, and portable equipment where size is a critical factor.
