BCM43570KFFBGT Overview
The BCM43570KFFBGT is a high-performance wireless communication module designed for robust, reliable connectivity in a variety of embedded systems. It integrates advanced Wi-Fi and Bluetooth functionalities, supporting dual-band 2.4 GHz and 5 GHz operations with enhanced throughput and low power consumption. This device is ideal for applications requiring seamless wireless data transfer and minimal interference, offering enhanced coexistence between protocols. Engineers and sourcing specialists will appreciate its compact form factor and comprehensive protocol support, making it suitable for industrial, consumer, and IoT applications. For more information on wireless communication ICs, visit IC Manufacturer.
BCM43570KFFBGT Technical Specifications
| Parameter | Specification |
|---|---|
| Wi-Fi Standard | 802.11ac Wave 2 (2×2 MIMO) |
| Frequency Bands | 2.4 GHz & 5 GHz dual-band |
| Bluetooth Version | Bluetooth 5.0 |
| Max Data Rate | 867 Mbps (Wi-Fi) |
| Modulation Techniques | OFDM, DSSS, CCK |
| Operating Voltage | 3.3 V |
| Interface | SDIO 3.0, UART, PCM |
| Package Type | FCBGA (7 x 7 mm) |
| Transmit Power | Up to +20 dBm |
| Receive Sensitivity | -92 dBm @ 11 Mbps |
BCM43570KFFBGT Key Features
- Dual-band Wi-Fi Connectivity: Supports 2.4 GHz and 5 GHz bands with 2×2 MIMO, enabling higher data rates and improved network reliability in congested environments.
- Bluetooth 5.0 Support: Provides enhanced range and throughput for seamless wireless device interconnection, essential for IoT and wearable applications.
- Low Power Consumption: Designed to optimize energy efficiency, extending battery life in portable and embedded systems without sacrificing performance.
- Integrated SDIO and UART Interfaces: Simplifies system integration, reducing design complexity and enabling easy communication with host processors.
BCM43570KFFBGT Advantages vs Typical Alternatives
This module offers superior wireless performance with dual-band support and advanced modulation schemes, delivering higher throughput and better coexistence than typical single-band devices. Its low power design and integrated interfaces enhance system reliability and ease of integration. The compact FCBGA package also provides a space-saving advantage over larger modules, making it an optimal choice for embedded wireless solutions.
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Typical Applications
- Embedded wireless connectivity in industrial automation systems, enabling reliable machine-to-machine communication and remote monitoring for enhanced operational efficiency.
- Consumer electronics such as smart TVs and set-top boxes, where high-speed dual-band Wi-Fi and Bluetooth are critical for seamless multimedia streaming and device pairing.
- IoT gateways and smart home devices requiring robust, low-latency wireless connections to support multiple sensors and control nodes.
- Wearable devices and portable electronics benefiting from low power consumption and compact design for extended battery life and ease of integration.
BCM43570KFFBGT Brand Info
Developed by a leading semiconductor innovator, this module represents a blend of advanced wireless technology and compact system design. It is part of a well-established product lineup known for delivering reliable wireless connectivity solutions in both industrial and consumer markets. The product is backed by extensive documentation, support, and compliance with industry standards, ensuring seamless integration and long-term availability for OEMs and system integrators.
FAQ
What wireless standards does this module support?
The device supports dual-band Wi-Fi based on the 802.11ac Wave 2 standard, including 2×2 MIMO, as well as Bluetooth 5.0. This combination ensures compatibility with modern wireless networks and devices.
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How does the power consumption of this module impact embedded applications?
Its low power design helps reduce overall energy usage, which is critical for battery-powered and portable systems. This efficiency extends operational time without compromising wireless performance or connectivity stability.
What interfaces are available for communication with host processors?
The module provides standard SDIO 3.0 and UART interfaces, along with PCM support, allowing flexible and straightforward integration with a wide range of host microcontrollers and processors.
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What package type is used and how does it benefit system design?
The FCBGA package measures 7 by 7 millimeters, offering a compact footprint that saves PCB space. This small size facilitates integration into space-constrained embedded systems and portable devices.
What applications are best suited for this wireless module?
This module excels in industrial automation, consumer electronics, IoT gateways, and wearable devices where reliable dual-band Wi-Fi and Bluetooth connectivity, combined with low power consumption, are essential for performance and user experience.
