BCM43236TBKML1WG Overview
The BCM43236TBKML1WG is a highly integrated wireless communication IC designed to support advanced connectivity solutions. This device combines multiple wireless standards, enabling seamless data transfer and connectivity in compact form factors. It offers robust performance with low power consumption, making it ideal for embedded systems requiring reliable wireless capabilities. With integrated RF and baseband functions, it simplifies system design and accelerates time-to-market for manufacturers. Engineers and sourcing specialists benefit from its proven architecture and compatibility with industry protocols. For more detailed information, visit IC Manufacturer.
BCM43236TBKML1WG Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards Supported | 802.11a/b/g/n |
| Frequency Range | 2.4 GHz and 5 GHz bands |
| Integration Level | Single-chip with RF, baseband, and MAC |
| Interface | SDIO 3.0, SPI |
| Supply Voltage | 1.8 V to 3.3 V |
| Transmit Power | Up to +18 dBm |
| Package Type | QFN |
| Operating Temperature Range | -40??C to +85??C |
BCM43236TBKML1WG Key Features
- Dual-band support: Enables operation on both 2.4 GHz and 5 GHz frequency bands for flexible deployment and reduced interference.
- High integration: Combines RF, baseband, and MAC layers in a single chip, simplifying design and reducing overall component count.
- Low power consumption: Optimized power management supports battery-operated devices, extending operational lifetime.
- High transmit power: Provides up to +18 dBm output, ensuring strong wireless signals for reliable connectivity in challenging environments.
BCM43236TBKML1WG Advantages vs Typical Alternatives
This device offers superior integration and dual-band functionality compared to standard single-band modules. Its low power design enhances battery efficiency, while high transmit power improves signal range and reliability. The inclusion of multiple interface options enables flexible system integration, making it a preferred choice for engineers seeking compact and robust wireless solutions.
🔥 Best-Selling Products
-
Texas Instruments BQ24075 Linear Battery Charger IC – 5mm x 4mm QFN Package
-
Texas Instruments INA219 Current Sensor Module – SOIC Package, Precision Monitoring
-
Texas Instruments LM4041 Precision Voltage Reference – SOT-23 Package
-
Texas Instruments OPA2134 Audio Op Amp – Dual, High-Performance, SOIC-8 Package
Typical Applications
- Embedded wireless modules for IoT devices, providing dual-band Wi-Fi connectivity with efficient power usage for smart home and industrial automation systems.
- Wireless network interface cards requiring compact size and reliable dual-band support.
- Consumer electronics such as smart TVs and media players that benefit from integrated Wi-Fi capabilities.
- Industrial control systems needing robust and stable wireless communication in harsh environments.
BCM43236TBKML1WG Brand Info
This wireless communication IC is developed by a globally recognized semiconductor leader known for innovation in connectivity solutions. The product line emphasizes high performance, integration, and power efficiency, addressing the demands of modern wireless applications. The device aligns with the brand??s commitment to quality and reliability, supported by comprehensive technical resources and global supply chain support.
FAQ
What wireless standards does this device support?
The product supports multiple wireless standards including 802.11a, b, g, and n, enabling flexible deployment across various Wi-Fi networks in both 2.4 GHz and 5 GHz frequency bands.
🌟 Featured Products
-
“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-
QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-
0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-
1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
What interfaces are available for integration with host systems?
It provides SDIO 3.0 and SPI interfaces, allowing easy connection to a wide range of host processors and microcontrollers commonly used in embedded applications.
What is the typical operating temperature range for this device?
The device operates reliably between -40??C and +85??C, making it suitable for both commercial and industrial environments that experience varying temperature conditions.
📩 Contact Us
How does the device manage power consumption?
It incorporates power-saving modes and optimized circuitry to minimize energy usage, which is critical for battery-powered and portable wireless devices requiring extended operational times.
What package type is used for this wireless IC?
The component is housed in a Quad Flat No-lead (QFN) package, which offers a compact footprint and efficient thermal performance, facilitating high-density PCB designs.
