BCM43235KMLG Overview
The BCM43235KMLG is a highly integrated wireless connectivity solution optimized for embedded applications requiring robust 802.11n Wi-Fi performance with Bluetooth 4.0 support. Designed for compact, low-power devices, this module offers dual-band operation with advanced coexistence features to minimize interference between wireless protocols. It supports a comprehensive set of interfaces including USB and SDIO, enabling flexible integration into a variety of industrial and consumer electronics. With proven reliability and streamlined integration, this device is ideal for engineers seeking a compact, efficient wireless communication module. For more detailed product information, visit IC Manufacturer.
BCM43235KMLG Technical Specifications
| Parameter | Specification |
|---|---|
| Wireless Standards | IEEE 802.11b/g/n, Bluetooth 4.0 |
| Frequency Bands | 2.4 GHz and 5 GHz dual-band |
| Wi-Fi Data Rate | Up to 150 Mbps (802.11n single stream) |
| Bluetooth Profiles Supported | HCI UART, HCI USB |
| Host Interface | SDIO 3.0, USB 2.0 |
| Operating Voltage | 3.3 V typical |
| Package Type | RoHS-compliant LGA module |
| Operating Temperature Range | -40??C to +85??C |
| Transmit Power | Up to 17 dBm (typical) |
| Receiver Sensitivity | -88 dBm at 11 Mbps (802.11b) |
BCM43235KMLG Key Features
- Dual-band 2.4 GHz and 5 GHz support: Enables flexible deployment in crowded wireless environments, reducing interference and improving overall connection reliability.
- Integrated Bluetooth 4.0: Provides seamless coexistence with Wi-Fi, allowing simultaneous data transfer and device control without performance degradation.
- Multi-interface support (SDIO and USB): Offers design versatility for different host processors, simplifying board layout and reducing development time.
- Low power consumption: Optimized for embedded applications requiring extended battery life, making it suitable for portable and IoT devices.
- Robust industrial temperature range: Ensures reliable operation in harsh environments, critical for industrial automation and outdoor applications.
BCM43235KMLG Advantages vs Typical Alternatives
This wireless module provides superior integration of Wi-Fi and Bluetooth in a compact form factor, offering excellent coexistence mechanisms that minimize cross-interference. Compared to typical alternatives, it delivers higher sensitivity and stable data rates, with enhanced power efficiency. These features reduce overall system complexity and improve reliability, making it a preferred choice for industrial and embedded wireless communication solutions.
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Typical Applications
- Embedded wireless communication in industrial automation equipment, where durable, dual-band Wi-Fi and Bluetooth connectivity ensures reliable data exchange in challenging environments.
- Smart home devices requiring seamless wireless control and data streaming capabilities with low power consumption.
- Portable medical instruments that benefit from compact design and extended operating temperature ranges for accurate remote monitoring.
- IoT gateways and sensors needing flexible interface options and robust wireless coexistence for stable connectivity.
BCM43235KMLG Brand Info
The BCM43235KMLG is part of a trusted product line designed by a leading semiconductor manufacturer known for advanced wireless solutions. This module embodies the brand’s commitment to innovation, reliability, and performance in industrial and consumer wireless communications. The product supports extensive certification and compliance standards, ensuring ease of integration and global deployment. Its compact design and comprehensive feature set reflect the brand??s expertise in delivering high-quality connectivity modules tailored to evolving market demands.
FAQ
What wireless standards does this module support?
This module supports IEEE 802.11b/g/n for Wi-Fi connectivity and Bluetooth 4.0, providing dual-band operation at 2.4 GHz and 5 GHz frequencies. This ensures compatibility with a wide range of wireless networks and devices.
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Which host interfaces are compatible with this wireless module?
It supports SDIO 3.0 and USB 2.0 host interfaces, allowing flexible integration with various embedded processors and microcontrollers, facilitating ease of system design and connectivity.
What is the operating temperature range of the module?
The device operates reliably within an industrial temperature range from -40??C to +85??C, making it suitable for demanding environmental conditions often encountered in industrial and outdoor applications.
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How does the module manage Wi-Fi and Bluetooth coexistence?
The module incorporates advanced coexistence features that minimize interference between Wi-Fi and Bluetooth signals. This allows simultaneous operation of both wireless protocols without compromising data throughput or connection stability.
What are the typical power requirements for this wireless solution?
The module typically operates at a voltage of 3.3 V with low power consumption optimized for embedded and portable applications. This enables longer battery life and efficient energy management in wireless-enabled devices.
