BCM43236BKML1G Wi-Fi Combo Chip Module ?C Wireless Connectivity, LGA Package

  • Integrates wireless connectivity to enable seamless communication in various embedded systems.
  • Supports high data rates, ensuring efficient and reliable network performance for demanding applications.
  • Features a compact package type that optimizes board space and facilitates flexible hardware design.
  • Ideal for IoT devices, providing stable wireless links that enhance device responsiveness and user experience.
  • Manufactured with quality control processes to maintain consistent performance and long-term reliability.
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产品上方询盘

BCM43236BKML1G Overview

The BCM43236BKML1G is a high-performance wireless communication integrated circuit designed for robust connectivity in industrial and consumer electronics. This highly integrated device supports multiple wireless standards, delivering reliable data transfer with optimized power consumption. Its compact design and advanced features enable seamless integration into diverse applications, including IoT devices, embedded systems, and wireless modules. Engineers and sourcing specialists will appreciate its precise specifications, ensuring compatibility and efficient operation in complex environments. For detailed technical information and sourcing options, visit IC Manufacturer.

BCM43236BKML1G Technical Specifications

Parameter Specification
Wireless Standards Supported 802.11a/b/g/n/ac
Operating Frequency 2.4 GHz and 5 GHz bands
Modulation Types BPSK, QPSK, 16-QAM, 64-QAM
Transmit Power Up to +20 dBm
Receiver Sensitivity ?90 dBm (typical)
Data Transfer Rate Up to 433 Mbps
Power Supply Voltage 3.3 V ?? 0.3 V
Package Type QFN 48-pin
Operating Temperature Range ?40 ??C to +85 ??C

BCM43236BKML1G Key Features

  • Dual-Band Support: Enables operation on both 2.4 GHz and 5 GHz frequencies, providing enhanced flexibility and reduced interference for dependable wireless communication.
  • High Data Throughput: Supports data rates up to 433 Mbps, ensuring efficient transmission for bandwidth-intensive industrial and consumer applications.
  • Low Power Consumption: Optimized power management features extend device lifetime and reduce thermal footprint, critical for battery-operated and embedded systems.
  • Compact QFN Package: The 48-pin QFN footprint facilitates space-saving PCB layouts, aiding integration into compact wireless modules and embedded designs.

BCM43236BKML1G Advantages vs Typical Alternatives

This device offers superior integration of dual-band wireless connectivity with high sensitivity and power efficiency compared to typical discrete solutions. Its wide operating temperature range and low power profile make it more reliable and suitable for demanding industrial environments. The compact package simplifies board design, reducing overall system cost and complexity while maintaining robust performance.

Typical Applications

  • Embedded wireless modules in IoT devices requiring stable dual-band communication and low power consumption to extend device operational life.
  • Industrial automation systems where reliable data transfer and operation across temperature extremes are essential for continuous monitoring and control.
  • Consumer electronics such as smart home devices that benefit from high data rates and seamless connectivity in crowded wireless environments.
  • Wireless network cards and adapters demanding compact integration and support for multiple wireless standards.

BCM43236BKML1G Brand Info

This product is part of a renowned semiconductor manufacturer??s portfolio, known for delivering advanced wireless communication solutions. Designed with a focus on performance, reliability, and integration ease, this integrated circuit meets stringent quality standards and supports a broad range of industrial and consumer applications. The brand??s commitment to innovation ensures continuous support and development for evolving wireless technology demands.

FAQ

What wireless standards does this device support?

The device supports multiple wireless standards including 802.11a, b, g, n, and ac. This enables compatibility with a wide range of wireless networks, ensuring flexible deployment in various communication scenarios.

What operating frequency bands are covered by this integrated circuit?

It operates on both 2.4 GHz and 5 GHz frequency bands, allowing dual-band operation. This feature helps reduce interference and improves wireless performance in congested environments.

What power supply requirements are necessary for proper operation?

The device requires a power supply voltage of approximately 3.3 volts with a tolerance of ??0.3 volts. Proper voltage regulation ensures optimal performance and reliability.

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产品中间询盘

What is the typical operating temperature range for this product?

This integrated circuit is rated to operate reliably across a broad temperature range from minus 40 degrees Celsius up to plus 85 degrees Celsius, making it suitable for harsh industrial environments.

What packaging format does the device come in for PCB integration?

The device is housed in a 48-pin Quad Flat No-lead (QFN) package. This compact form factor facilitates high-density PCB designs and efficient thermal management.

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