BCM89836A0BFBG Overview
The BCM89836A0BFBG is a robust high-performance physical layer device designed for advanced Ethernet applications. It integrates a 10GBASE-KR PHY interface supporting 10 Gigabit Ethernet over backplane connections, ensuring reliable data transmission with low latency. Engineered for industrial and enterprise networking equipment, this component supports energy-efficient operation and advanced diagnostics. Its compact form factor and comprehensive feature set make it ideal for high-density switch and router designs, offering seamless integration with existing network infrastructures. For detailed technical support and procurement, visit IC Manufacturer.
BCM89836A0BFBG Technical Specifications
| Parameter | Specification |
|---|---|
| Data Rate | 10 Gbps |
| Standard Compliance | IEEE 802.3ap 10GBASE-KR |
| Interface Type | Backplane Ethernet PHY |
| Power Consumption | Typical 1.5 W |
| Package | FBGA (Fine-pitch Ball Grid Array) |
| Operating Temperature | -40??C to +85??C |
| Loopback Modes | Near-end and Far-end loopback supported |
| Diagnostic Features | Link fault signaling, error counters |
BCM89836A0BFBG Key Features
- 10GBASE-KR Backplane Support: Enables high-speed 10 Gigabit Ethernet connectivity over backplane, providing low-latency and high-throughput data transfer critical for enterprise networking.
- Advanced Energy Efficiency: Implements power-saving modes that reduce overall system power consumption without compromising performance, essential for energy-conscious designs.
- Comprehensive Diagnostic Capabilities: Offers built-in link fault signaling and detailed error counters, facilitating easy troubleshooting and enhancing network reliability.
- Wide Operating Temperature Range: Supports industrial environments with reliable operation from -40??C to +85??C, ensuring stable performance in harsh conditions.
BCM89836A0BFBG Advantages vs Typical Alternatives
This device excels over typical alternatives with its compliance to the IEEE 802.3ap standard, delivering precise 10 Gbps performance optimized for backplane applications. Its low power consumption and enhanced diagnostic features improve system reliability and reduce operational costs. The compact FBGA package allows for high-density board layouts, making it a preferred choice for modern networking equipment seeking integration efficiency and thermal management.
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Typical Applications
- High-density Ethernet switches and routers requiring 10GBASE-KR physical layer support for backplane interconnects, ensuring efficient data center and enterprise networking performance.
- Network interface cards (NICs) designed for 10 Gigabit Ethernet communications over backplane connections in server and storage systems.
- Telecommunications equipment that demands reliable high-speed data transfer with advanced diagnostic capabilities for network maintenance.
- Industrial Ethernet systems operating under extended temperature ranges, where robust performance and energy efficiency are critical.
BCM89836A0BFBG Brand Info
The BCM89836A0BFBG is a product from a leading semiconductor manufacturer specializing in high-speed networking solutions. This PHY device reflects the brand??s commitment to delivering cutting-edge Ethernet technology combined with power efficiency and diagnostic intelligence. The product line is supported by comprehensive technical resources and global supply chain capabilities, ensuring dependable availability and expert assistance for system designers and sourcing professionals.
FAQ
What standards does this device support for Ethernet communication?
The device fully complies with the IEEE 802.3ap standard, specifically supporting the 10GBASE-KR physical layer for 10 Gigabit Ethernet over backplane connections. This ensures interoperability with other compliant network devices and reliable high-speed data transmission.
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What are the typical power consumption characteristics of this component?
Typical power consumption is approximately 1.5 watts during operation. This low power profile supports energy-efficient designs in networking equipment, helping reduce overall heat generation and operational costs.
Can this device operate in industrial temperature environments?
Yes, it is rated to operate reliably over a wide temperature range from -40??C to +85??C. This makes it suitable for use in industrial and other harsh environmental conditions where temperature stability is essential.
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What diagnostic features are integrated into this PHY device?
The device includes built-in link fault signaling and error counters, enabling network engineers to quickly identify and resolve connection issues. These diagnostic capabilities enhance system uptime and simplify maintenance procedures.
What packaging options are available for this Ethernet PHY component?
This product is provided in a fine-pitch ball grid array (FBGA) package, which supports high-density PCB layouts and efficient thermal management, facilitating integration into compact and complex networking hardware.
