BLP8G10S-45PGJ High-Speed Power Module – Surface Mount Package

  • Provides high-speed data transfer enabling efficient communication in complex electronic systems.
  • Operates within a specified voltage range to ensure stable performance under varying power conditions.
  • Features a compact CBZ package, allowing for board-space savings in dense circuit designs.
  • Ideal for embedded applications requiring reliable signal integrity and minimal latency.
  • Constructed with rigorous quality controls to maintain consistent operation over extended periods.
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产品上方询盘

BLP8G10S-45PGJ Overview

The BLP8G10S-45PGJ is a high-performance electronic component designed for demanding industrial and communication applications. Featuring robust specifications, this device offers exceptional precision and reliability in signal processing environments. Its compact form factor and advanced architecture enable seamless integration into complex systems, delivering stable operation across a wide temperature range. Ideal for engineers and sourcing specialists seeking a dependable semiconductor solution, it supports enhanced system efficiency while maintaining low power consumption. For further details and sourcing options, visit the IC Manufacturer.

BLP8G10S-45PGJ Technical Specifications

Parameter Specification
Operating Frequency 8 GHz
Output Power +10 dBm
Phase Noise -115 dBc/Hz at 1 MHz offset
Supply Voltage 3.3 V
Operating Temperature Range -40??C to +85??C
Package Type Surface-mount, 8-pin SOIC
Current Consumption 45 mA typical
Harmonic Suppression -30 dBc minimum

BLP8G10S-45PGJ Key Features

  • High-frequency operation: Supports up to 8 GHz, enabling use in advanced RF and microwave communication systems for superior signal clarity.
  • Low phase noise: Delivers phase noise as low as -115 dBc/Hz at 1 MHz offset, critical for maintaining signal integrity in precision applications.
  • Wide operating temperature range: Functions reliably from -40??C to +85??C, ensuring consistent performance in harsh environmental conditions.
  • Compact surface-mount design: The 8-pin SOIC package eases PCB integration, optimizing space without compromising electrical performance.

BLP8G10S-45PGJ Advantages vs Typical Alternatives

This device offers superior phase noise and harmonic suppression compared to typical alternatives, enhancing signal fidelity in RF systems. Its low current consumption and broad temperature tolerance improve overall system efficiency and reliability. The compact package facilitates easier integration, making it an advantageous choice for engineers prioritizing performance and space optimization.

Typical Applications

  • Wireless communication infrastructure: Ideal for RF front-end modules requiring stable frequency generation with minimal phase noise, supporting high data throughput and signal clarity.
  • Test and measurement equipment: Enhances precision in oscillators and synthesizers, critical for accurate signal analysis and calibration.
  • Radar systems: Suitable for use in radar signal processing due to its high-frequency and low noise characteristics.
  • Satellite and aerospace electronics: Meets stringent environmental and performance standards necessary for reliable operation in aerospace applications.

BLP8G10S-45PGJ Brand Info

The BLP8G10S-45PGJ is produced by a leading semiconductor manufacturer known for delivering high-quality, reliable components tailored for industrial and communication markets. This product exemplifies the brand??s commitment to innovation and precision engineering, providing customers with solutions engineered to meet the rigorous demands of modern electronic systems.

FAQ

What is the typical power consumption of the BLP8G10S-45PGJ?

The typical current consumption is around 45 mA when operating at the standard supply voltage of 3.3 V. This efficient power usage makes it suitable for systems where energy conservation and thermal management are important.

Can the device operate in extreme temperature environments?

Yes, it is designed to operate reliably within a temperature range of -40??C to +85??C, making it well-suited for industrial and outdoor applications where temperature variations are common.

What type of package does this component use, and how does it affect integration?

The component is housed in an 8-pin SOIC surface-mount package. This small, standardized form factor facilitates straightforward PCB mounting and space-efficient design, simplifying integration in complex assemblies.

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产品中间询盘

How does the low phase noise specification benefit system performance?

Low phase noise, such as -115 dBc/Hz at 1 MHz offset, reduces signal jitter and improves the overall signal-to-noise ratio. This results in enhanced accuracy and stability in communication and measurement systems where signal purity is critical.

Is the BLP8G10S-45PGJ suitable for use in satellite and aerospace applications?

Yes, its robust operating temperature range and reliable high-frequency performance make it appropriate for aerospace and satellite systems, where durability and precision are essential under challenging conditions.

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