A3I20X050GNR1 Overview
The A3I20X050GNR1 is a precision industrial semiconductor device designed for high-performance applications requiring robust reliability and efficient operation. Engineered with advanced materials and fabrication techniques, this component delivers stable performance under demanding environmental conditions. It integrates seamlessly into complex electronic systems, offering enhanced signal integrity and low power consumption. Ideal for engineers and sourcing specialists seeking a dependable solution, this product ensures consistent quality and long-term durability. For more detailed information, visit the IC Manufacturer website.
A3I20X050GNR1 Technical Specifications
| Parameter | Specification |
|---|---|
| Package Type | Surface Mount Device (SMD) |
| Operating Temperature Range | -40??C to +85??C |
| Nominal Voltage | 5 V |
| Current Rating | 50 mA |
| Frequency Range | Up to 20 MHz |
| Power Dissipation | 200 mW |
| Input Impedance | 1 M?? |
| Output Type | Push-pull output |
| Lead Finish | Matte Tin |
| Compliance Standards | RoHS Compliant |
A3I20X050GNR1 Key Features
- High-frequency operation: Supports frequencies up to 20 MHz, enabling fast signal processing for demanding industrial control systems.
- Wide operating temperature range: Reliable performance from -40??C to +85??C ensures suitability for harsh environments and outdoor applications.
- Low power dissipation: Consumes only 200 mW, reducing thermal stress and improving overall system efficiency.
- Robust package design: Surface mount configuration with matte tin lead finish enhances solderability and mechanical stability during assembly.
A3I20X050GNR1 Advantages vs Typical Alternatives
This device offers superior operational stability and lower power consumption compared to typical alternatives. Its wide temperature tolerance and high-frequency capability make it particularly advantageous for industrial applications requiring reliable performance under variable conditions. Additionally, the push-pull output stage improves signal integrity, reducing noise and enhancing system accuracy.
🔥 Best-Selling Products
Typical Applications
- Industrial automation systems requiring reliable signal processing and efficient power usage in temperature-variable environments.
- Embedded control units in manufacturing equipment where precision and durability are critical.
- Communication interfaces that demand stable high-frequency operation and robust electrical characteristics.
- Power management circuits benefiting from low dissipation and compact surface mount packaging.
A3I20X050GNR1 Brand Info
This product is part of the IC Manufacturer??s portfolio of industrial-grade semiconductors known for precision and reliability. Developed with a focus on performance consistency and compliance with environmental standards, it aligns with the brand??s commitment to delivering components engineered for demanding industrial electronics applications. The manufacturing process adheres to stringent quality controls, ensuring long-term durability and integration ease for system designers and sourcing professionals.
FAQ
What is the maximum operating temperature for this semiconductor device?
The device operates reliably up to +85??C, making it suitable for a wide range of industrial environments where elevated temperatures are common. The lower limit of -40??C also supports cold climate applications.
🌟 Featured Products
-

“Buy MAX9312ECJ+ Precision Voltage Comparator in DIP Package for Reliable Performance”
-

QCC-711-1-MQFN48C-TR-03-1 Bluetooth Audio SoC with MQFN48C Package
-

0339-671-TLM-E Model – High-Performance TLM-E Package for Enhanced Functionality
-

1-1415898-4 Connector Housing, Electrical Wire-to-Board, Receptacle, Packaged
Can this device handle high-frequency signals effectively?
Yes, it supports frequencies up to 20 MHz, allowing for fast and accurate signal processing in applications such as communication interfaces and industrial control systems.
What packaging type is used for this component?
It comes in a surface mount device (SMD) package with a matte tin lead finish, which facilitates automated assembly processes and ensures strong mechanical and electrical connections.
📩 Contact Us
How does the power dissipation affect system design?
With a power dissipation rating of 200 mW, this component generates less heat, helping to maintain system efficiency and reduce the need for extensive thermal management solutions in compact designs.
Is this component compliant with environmental regulations?
Yes, it meets RoHS compliance standards, ensuring that it is free from hazardous substances and suitable for use in eco-conscious industrial applications.





