MW7IC2725GNR1 Overview
The MW7IC2725GNR1 is a high-performance integrated circuit designed for industrial and consumer electronics applications. Engineered by IC Manufacturer, this device offers robust electrical characteristics, ensuring reliable operation across a wide temperature and voltage range. Its compact form factor and optimized architecture enable efficient system integration, making it suitable for complex electronic designs requiring precision and durability. The MW7IC2725GNR1 balances power consumption and processing capability, delivering consistent performance for demanding environments.
MW7IC2725GNR1 Technical Specifications
| Parameter | Specification |
|---|---|
| Operating Voltage Range | 2.7 V to 3.6 V |
| Input Voltage (Max) | 3.6 V |
| Operating Temperature Range | -40??C to +85??C |
| Package Type | QFN (Quad Flat No-Lead), 32 pins |
| Data Transfer Rate | Up to 25 Mbps |
| Power Consumption | Typical 7 mA at 3.3 V |
| Interface Type | SPI (Serial Peripheral Interface) |
| ESD Protection | ??4 kV HBM (Human Body Model) |
MW7IC2725GNR1 Key Features
- High-Speed SPI Interface: Enables fast and efficient data communication, reducing latency and improving overall system responsiveness.
- Wide Operating Voltage Range: Supports 2.7 V to 3.6 V, allowing compatibility with various power supply designs and enhancing flexibility in system integration.
- Robust Thermal Performance: Operates reliably from -40??C to +85??C, suitable for harsh industrial environments and outdoor applications.
- Compact QFN Package: Minimizes PCB space usage while maintaining excellent thermal dissipation and signal integrity for complex layouts.
MW7IC2725GNR1 Advantages vs Typical Alternatives
This device offers superior integration by combining a high data transfer rate with low power consumption, outperforming typical alternatives in efficiency and reliability. Its extended temperature range and strong ESD protection increase operational robustness, reducing failure rates in challenging environments. The compact package and versatile voltage support also facilitate easier system design and sourcing compared to conventional ICs.
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Typical Applications
- Industrial control systems requiring reliable communication interfaces and robust operation across temperature extremes, ensuring continuous operation in factory automation or process control.
- Embedded systems where compact size and low power are critical for portable or battery-powered devices.
- Consumer electronics that demand efficient SPI communication for enhanced performance with minimal energy consumption.
- Automotive electronics where extended temperature tolerance and ESD protection contribute to system safety and longevity.
MW7IC2725GNR1 Brand Info
Produced by a leading semiconductor company, this integrated circuit reflects the brand??s commitment to quality and innovation in industrial-grade components. The MW7IC2725GNR1 embodies the manufacturer’s expertise in balancing performance, reliability, and manufacturability. It is supported by comprehensive documentation and technical support, ensuring ease of adoption for engineers and sourcing specialists alike.
FAQ
What is the maximum operating voltage supported by this IC?
The maximum operating voltage supported is 3.6 V, allowing for compatibility with a range of 3.3 V-based power systems typically used in industrial and consumer electronics.
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How does the MW7IC2725GNR1 handle extreme temperature conditions?
This device is rated to operate reliably within a temperature range of -40??C to +85??C, making it suitable for applications exposed to harsh environmental conditions such as outdoor or industrial settings.
What type of communication interface does this device use?
The integrated circuit utilizes a Serial Peripheral Interface (SPI), which enables high-speed, synchronous data transfer and efficient communication with microcontrollers and other digital systems.
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Is the package type suitable for high-density PCB layouts?
Yes, the 32-pin QFN package is designed for compactness and excellent thermal performance, making it ideal for high-density PCB designs where space and heat dissipation are critical factors.
What measures are incorporated for device protection against electrostatic discharge?
The component features ??4 kV Human Body Model ESD protection, providing robust defense against electrostatic discharge events, thereby enhancing device reliability during handling and operation.
